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US 11,901,308 B2Granted
Semiconductor packages with integrated shielding
AssigneeUTAC Headquarters Pte. Ltd.
InventorsSaravuth Sirinorakul, Il Kwon Shim, Kok Chuen Lock, Roel Adeva Robles, Eakkasit Dumsong
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.
Claims20
A device comprising:
- a package substrate having a die attach pad (DAP) and package pads;
- a die disposed on the DAP, the die is electrically coupled to the package pads;
- a primary electromagnetic interference (EMI) shield structure, the primary EMI shield structure comprises
- a primary EMI planar member covering the die,
- a first primary EMI leg member contiguous to a first side of the primary EMI planar member and extending downwards to the package substrate, the primary EMI shield structure forms a cavity over the die in which a cavity height of the cavity is defined by the first primary EMI leg member, wherein adjacent opposing sides of the first side of the primary EMI planar member do not include leg members extending downwards to the package substrate, leaving the die exposed on the adjacent opposing sides of the primary EMI planar member, and
- wherein the primary EMI shield structure is electrically coupled to ground;
- and
- an encapsulant, the encapsulant covers the first primary EMI leg member and the package substrate.
5 more elements
A device comprising:
- a package substrate having a die attach pad (DAP) and package pads;
- a die disposed on the DAP, the die is electrically coupled to the package pads;
- an encapsulation layer, the encapsulation layer covers the package substrate and the die, the encapsulation layer having a top encapsulation surface disposed above a top die surface;
- a primary electromagnetic interference (EMI) shield structure, the primary EMI shield structure comprises a primary EMI planar member, the primary EMI planar member is disposed on the top encapsulation surface;
- and
- a secondary EMI shield structure, the secondary EMI shield structure comprises
- a secondary EMI planar member the secondary EMI planar member disposed on a top primary planar surface of the primary EMI planar member,
- secondary EMI side members, the secondary EMI side members extend downwards from second planar member side surfaces of the secondary EMI planar member towards the package substrate,
- the secondary EMI shield structure encases the primary EMI shield structure, the die and encapsulation layer, the secondary EMI shield structure serves as an external EMI shield structure of the device, and
- wherein the secondary EMI shield structure is coupled to ground.
7 more elements
A device comprising:
- a package substrate having a die attach pad (DAP) and package pads;
- a die disposed on the DAP, the die is electrically coupled to the package pads;
- an encapsulation layer, the encapsulation layer covers the package substrate and the die, the encapsulation layer having a top encapsulation surface disposed above a top die surface;
- an electromagnetic interference (EMI) shield structure, the EMI shield structure comprises
- an EMI planar member disposed on the top encapsulation layer surface,
- EMI side members, the EMI side members extend downwards from along a complete length of planar member side surfaces of the EMI planar member towards the package substrate without contacting the package substrate,
- the EMI shield structure encases the die and encapsulation layer, the EMI shield structure serves as an external EMI shield structure of the device, and
- wherein the EMI shield structure is coupled to ground by wire bonds connected to at least one of the EMI side members.
5 more elements
Dependencies are inferred from the claim text.