InFO-POP structures with TIVs having cavities
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
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Abstract
A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
Claims20
A structure comprising:
- a device die;
- an encapsulant encapsulating the device die therein;
- a through-via penetrating through the encapsulant, wherein the through-via comprises a copper post with substantially straight edges;
- a polymer extending into the encapsulant;
- and
- a solder region over and joined to the through-via, wherein both of the polymer and the solder region extend into a recess in the copper post.
A structure comprising:
- a device die;
- a die-attach film over the device die;
- a molding compound comprising:
- a first portion encircling and contacting the device die, wherein the first portion comprises a first top surface coplanar with a second top surface of the die-attach film;
- and
- a second portion comprising a third top surface lower than the first top surface;
- a through-via in the second portion of the molding compound;
- a polymer region extending into both of the molding compound and the through-via, wherein the through-via comprises side portions on opposite sides of the polymer region;
- and
- a solder region extending into both of the molding compound and the through-via.
A structure comprising:
- a device die;
- a molding compound molding the device die therein, wherein the molding compound comprises:
- a first plurality of top surfaces that are planar;
- and
- a second plurality of top surfaces that are curved, wherein top ends of the second plurality of top surfaces are joined to respective ones of the first plurality of top surfaces;
- a plurality of through-vias in the molding compound, wherein one of the plurality of through-vias comprises a straight sidewall extending from a bottom end of one of the second plurality of top surfaces of the molding compound to a bottom surface of the molding compound;
- a solder region;
- and
- a polymer region on opposing sides of and contacting the solder region, wherein both of the solder region and the polymer region extend into one of the plurality of through-vias.
Dependencies are inferred from the claim text.