Back to results
US 11,901,301 B2Granted
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsJeongho Lee, Doohwan Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the frame structure and the semiconductor chip, and is connected to the lower pad and the bump pad. A molding member covers the frame structure and the semiconductor chip and fills the cavity. The molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pad, and the bump pad.
Claims19
A semiconductor package comprising:
- a frame structure comprising a core portion and a plurality of lower pads under the core portion, wherein a cavity penetrates the core portion;
- a semiconductor chip arranged in the cavity, wherein the semiconductor chip comprises an active surface on which a plurality of bump pads are arranged and a non-active surface opposite the active surface, wherein the bump pads protrude from the active surface of the semiconductor chip and have a polygonal column shape or a cylindrical shape;
- a redistribution structure under the frame structure and the semiconductor chip, wherein the redistribution structure is connected to the lower pads and the bump pads;
- and
- a molding member that is on the frame structure and the semiconductor chip, and that is in the cavity,
- wherein the molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pads, and the bump pads, wherein the molding member contacts a side surface of the bump pads, wherein the molding member covers an upper surface of the core portion, a lower surface of the core portion, and a side surface of the core portion, and wherein the molding member fills a space between the lower pads and a space between the bump pads, and wherein the molding member contacts an upper surface of the redistribution structure.
3 more elements
A semiconductor package comprising:
- a first sub-package comprising a first semiconductor chip;
- a second sub-package on the first sub-package and comprising a second semiconductor chip;
- and
- a connection structure connecting the first sub-package to the second sub-package,
- wherein the first sub-package comprises:
- a frame structure comprising a core portion and a lower pad under the core portion, wherein a cavity penetrates the core portion;
- wherein the first semiconductor chip is arranged in the cavity, wherein the first semiconductor chip comprises an active surface on which a bump pad is arranged and a non-active surface opposite the active surface, wherein the bump pad protrudes from the active surface of the semiconductor chip and has a polygonal column shape or a cylindrical shape;
- a redistribution structure under the frame structure and the first semiconductor chip, wherein the redistribution structure is connected to the lower pad and the bump pad;
- and
- a molding member that is on the frame structure and the first semiconductor chip, and that is in the cavity, wherein the molding member contacts a side surface of the bump pad, and wherein the molding member covers an upper surface of the core portion, a lower surface of the core portion, and a side surface of the core portion,
- wherein the lower pad protrudes from the core portion, and
- wherein a lower surface of the lower pad, a lower surface of the bump pad, and a lower surface of the molding member are coplanar.
9 more elements
A semiconductor package comprising:
- a frame structure comprising a core portion, an upper pad on the core portion, a lower pad under the core portion, and a through via that connects the upper pad to the lower pad, and wherein a cavity penetrates the core portion;
- a semiconductor chip arranged in the cavity and having an active surface on which a bump pad is arranged and a non-active surface opposite the active surface, wherein the bump pad protrudes from the active surface of the semiconductor chip and has a polygonal column shape or a cylindrical shape;
- a redistribution structure under the frame structure and the semiconductor chip and including a redistribution line and a redistribution via connected to the redistribution line, the redistribution via having a tapered shape that increases in width as a distance from the semiconductor chip increases;
- a molding member that is on the frame structure, the semiconductor chip, and the redistribution structure, and that is in the cavity;
- and
- an external connection terminal arranged under the redistribution structure and electrically connected to the redistribution line and the redistribution via,
- wherein the molding member surrounds all surfaces of the semiconductor chip, a lower surface of the frame structure, an upper surface of the redistribution structure, a side surface of the lower pad, and contacts a side surface of the bump pad, and wherein the molding member covers an upper surface of the core portion, a lower surface of the core portion, and a side surface of the core portion.
4 more elements
Dependencies are inferred from the claim text.