Universal interposer for a semiconductor package

A chip package comprising:

• a package substrate;
• and
• an interposer comprising a body having a first surface and a second surface opposite the first surface, the second surface of the body mechanically and electrically coupled to the interposer, the interposer further comprising:
• a first region formed on a first side of the body along a first edge of the body, the first region having a plurality of first slots, each first slot having an identical first bond pad layout;
• a second region formed on the first side of the body along a second edge of the body, the second edge disposed opposite the first edge, the second region having a plurality of second slots, each second slot having an identical second bond pad layout;
• and
• a third region formed on the first side of the body between the first and second regions, the third region having a plurality of third slots, each third slot having an identical third bond pad layout;
• wherein:
• the third bond pad layouts have a pad density greater than a pad density of the first bond pad layouts;
• wherein:
• one of the plurality of third slots spaced from a third edge of the body by at least one or more other third slots includes bond pads that are coupled to contact pads disposed along the first edge of the body;
• and wherein:
• one of the plurality of third slots disposed adjacent the third edge of the body that couples the first and second edges includes bond pads that are coupled to contact pads disposed along the second edge of the body in a region not directly below any of the second slots;
• and
• at least a first integrated circuit (IC) die mechanically and electrically coupled to bond pads of one of the third bond pad layouts formed in one of the third slots in the third region.