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US 11,901,298 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorKenji Ikura
Life of this patent
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Abstract
A semiconductor device has a semiconductor chip having a plurality of pads and wires electrically connected to the plurality of pads, respectively. The plurality of pads includes a plurality of first pads which is electrically connected to a circuit included in the semiconductor chip and to which first wires are bonded and a second pad which is an electrode pad for wire connection test and to which a second wire is bonded.
Claims6
A method of manufacturing a semiconductor device comprising steps of:
- (a) preparing a semiconductor chip having a first main surface, a second main surface on an opposite side of the first main surface, and a plurality of electrode pads exposed on the first main surface;
- and
- (b) after the (a), connecting wires to the plurality of electrode pads, respectively,
- wherein the plurality of electrode pads includes:
- a plurality of first electrode pads which is electrically connected to a circuit included in the semiconductor chip and to which first wires are bonded in the (b);
- and
- a second electrode pad to which a second wire is bonded in the (b), and
- wherein the (b) includes steps of:
- (b1) bonding the second wire to the second electrode pad by using a wire bonding apparatus and measuring a current or a voltage which controls an operation of the wire bonding apparatus at the time of bonding the second wire;
- (b2) determining pass or fail of a machining operation by the wire bonding apparatus based on measured data obtained in the (Ill);
- and
- (b3) sequentially bonding the first wires to the plurality of first electrode pads, respectively, by using the wire bonding apparatus.
9 more elements
Dependencies are inferred from the claim text.