Semiconductor device structure with resistive element

A semiconductor device structure, comprising:

• a substrate;
• a resistive element over the substrate;
• and
• a thermal conductive element over the substrate, wherein a direct projection of the thermal conductive element on a main surface of the resistive element covers a center of the main surface of the resistive element, the direct projection of the thermal conductive element extends across a portion of a first imaginary line and a portion of a second imaginary line of the main surface, and the first imaginary line and the second imaginary line intersect at the center of the main surface.

A semiconductor device structure, comprising:

• a substrate;
• a resistive element over the substrate;
• and
• a thermal conductive element over the resistive element, wherein a direct projection of the thermal conductive element on a main surface of the resistive element extends across a portion of a first imaginary line and a portion of a second imaginary line of the main surface, and the first imaginary line and the second imaginary line intersect at a center of the main surface.