Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsTetsuya Iida, Yasutaka Nakashiba, Shinichi Uchida
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor substrate, a semiconductor element, and a multilayer wiring. The semiconductor element is formed on the semiconductor substrate. The multilayer wiring includes a wiring electrically connected with the semiconductor element, and a first inductor. The multilayer wiring is formed on the semiconductor substrate such that the multilayer wiring covers the semiconductor element. The first inductor is formed such that the first inductor electrically isolated from the wiring and is magnetically connected with the wiring.
Claims20
A semiconductor device comprising:
- a semiconductor substrate;
- a semiconductor element formed on the semiconductor substrate;
- and
- a multilayer wiring formed on the semiconductor substrate such that the multilayer wiring covers the semiconductor element, the multilayer wiring comprising:
- a wiring electrically connected with the semiconductor element;
- and
- a first inductor,
- wherein the first inductor is configured to be electrically isolated from the wiring and be magnetically connected with the wiring,
- wherein the first inductor comprises:
- a plurality of extending portions extending along a first direction which is an extending direction of the wiring;
- and
- a plurality of connecting portions respectively connecting two adjacent extending portions with each other.
A method comprising:
- (a) providing a semiconductor device comprising a multilayer wiring in which a wiring and an inductor are formed;
- (b) supplying a current into the wiring;
- and
- (c) detecting an electromotive voltage generated in the inductor when the current is supplied into the wiring,
- wherein the inductor is configured to be electrically isolated from the wiring and be magnetically connected with the wiring, and
- wherein the inductor comprises:
- a plurality of extending portions extending along a first direction which is an extending direction of the wiring;
- and
- a plurality of connecting portions respectively connecting two adjacent extending portions with each other.
A semiconductor device comprising:
- a semiconductor substrate;
- a semiconductor element formed on the semiconductor substrate;
- and
- a multilayer wiring formed on the semiconductor substrate such that the multilayer wiring covers the semiconductor element, the multilayer wiring comprising:
- a wiring electrically connected with the semiconductor element;
- a first inductor;
- and
- a second inductor,
- wherein the first inductor is configured to be electrically isolated from the wiring and be magnetically connected with the wiring,
- wherein the second inductor is configured to be electrically isolated from the wiring and be magnetically connected with the wiring,
- wherein the second inductor is electrically connected with the first inductor, and
- wherein a first central axis of the first inductor and a second central axis of the second inductor are along a main surface of the semiconductor substrate.
Dependencies are inferred from the claim text.