Microelectronic arrangement and method for manufacturing the same

Method for manufacturing a microelectronic arrangement, comprising:

• providing a chip-film module with a semiconductor chip and a film substrate having arranged thereon the semiconductor chip, wherein the chip-film module comprises at least one coupling element spaced apart from the semiconductor chip and electrically coupled to at least one terminal of the semiconductor chip, and
• fully embedding the chip-film module into a printed circuit board, wherein, in embedding the chip-film module into the printed circuit board, the at least one coupling element of the chip-film module is coupled vertically to at least one coupling counter element of the printed circuit board,
• wherein the film substrate comprises a film thickness of 10 to 200 μm,
• wherein an area of the film substrate is greater than a chip area of the semiconductor chip,
• wherein at least one coupling element of the at least one coupling element of the chip-film module is
• an optical coupling element, wherein at least one coupling counter element of the at least one coupling counter element of the printed circuit board is an optical coupling counter element,
• or an inductive coupling element, wherein at least one coupling counter element of the at least one coupling counter element of the printed circuit board is an inductive coupling counter element,
• or a capacitive coupling element, wherein at least one coupling counter element of the at least one coupling counter element of the printed circuit board is a capacitive coupling counter element.