Capacitor and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWan-Te Chen, Chung-Hui Chen, Wei Chih Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWan-Te Chen, Chung-Hui Chen, Wei Chih Chen
Estimating the term…
An integrated circuit (IC) structure includes a semiconductor substrate, a bottom electrode routing, a capacitor structure, a top electrode routing. The bottom electrode routing is over the semiconductor substrate. The capacitor structure is over the bottom electrode routing. The capacitor structure includes a bottom metal layer, a middle metal layer above the bottom metal layer, and a top metal layer above the middle metal layer. When viewed in a plan view, the top metal layer has opposite straight edges extending along a first direction and opposite square wave-shaped edges connecting the opposite straight edges, the square wave-shaped edges each comprise alternating first and second segments extending along a second direction perpendicular to the first direction, and third segments each connecting adjacent two of the first and second segments, wherein the third segments extend along the first direction.
A method, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.