Bonded structures with integrated passive component

A passive electronic component having a first surface and a second surface opposite the first surface, the passive electronic component comprising:

• a nonconductive material;
• a capacitor embedded within the nonconductive material, the capacitor having a first electrode, a second electrode, and a dielectric material disposed between the first and second electrodes, the first electrode comprising a first conductive layer and a plurality of elongate conductors extending vertically from and electrically connected to the first conductive layer, the plurality of elongate conductors comprising a different material from the first conductive layer, the plurality of elongate conductors each having a maximum horizontal dimension and a maximum vertical dimension greater than the maximum horizontal dimension, the maximum horizontal dimension being the maximum dimension of each elongate conductor in all horizontal directions;
• a first conductive via extending through the passive electronic component vertically from the first surface to the second surface, the first conductive via electrically connected to the first electrode;
• a first conductive contact at the first surface, the first conductive contact electrically connected to the second electrode;
• a second conductive contact at the second surface, the second conductive contact electrically connected to the first electrode;
• a second conductive via extending through the passive electronic component from the first surface to the second surface, the second conductive via electrically connected to the second electrode;
• a first terminal formed with or electrically connected to the first conductive via and a second terminal formed with or electrically connected to the second conductive via, the first and second terminals exposed at or near the first surface of the passive electronic component;
• a third terminal formed with or electrically connected to the first conductive via and a fourth terminal formed with or electrically connected to the second conductive via, the third and fourth terminals exposed at or near the second surface of the passive electronic component.

A passive electronic component having a first surface and a second surface opposite the first surface, the passive electronic component comprising:

• a first conductive layer;
• a plurality of conductive fibers extending from a surface of the first conductive layer such that a first plurality of conductive fibers are arranged laterally along a first direction on the surface of the first conductive layer and a second plurality of conductive fibers are arranged laterally along a second direction on the surface of the first conductive layer non-parallel with the first direction, the plurality of conductive fibers each having a maximum horizontal dimension and a maximum vertical dimension greater than the maximum horizontal dimension, the maximum horizontal dimension being the maximum dimension of each conductive fiber in all horizontal directions, the first conductive layer extends at least between two adjacent conductors of the plurality of conductive fibers;
• a dielectric layer conformally coating the conductive fibers;
• a second conductive layer conformally coating the dielectric layer;
• a first terminal on the first surface of the passive electronic component, the first terminal electrically connected to the first conductive layer;
• a second terminal on the first surface of the passive electronic component, the second terminal electrically connected to the second conductive layer;
• and
• a third terminal on the second surface of the passive electronic component, the third terminal electrically connected to the first conductive layer.

A method of forming a bonded structure, the method comprising:

• providing a passive electronic component having a capacitor embedded within a nonconductive material, the capacitor having a first electrode, a second electrode, and a dielectric material disposed between the first and second electrodes, the first electrode comprising a first conductive layer and a plurality of elongate conductors extending from and electrically connected to the first conductive layer, the plurality of elongate conductors each having a maximum horizontal dimension and a maximum vertical dimension greater than the maximum horizontal dimension, the maximum horizontal dimension being the maximum dimension of each elongate conductor in all horizontal directions, the first conductive layer extends at least between two adjacent conductors of the plurality of elongate conductors, a first capacitance defined between the first layer and the second electrode and a second capacitance defined between the plurality of elongate conductors and the second electrode, the plurality of elongate conductors comprising a first plurality of conductors arranged laterally along a first direction on a surface of the first conductive layer and a second plurality of conductors arranged laterally along a second direction on the surface of the first conductive layer non-parallel with the first direction;
• providing a first conductive via that extends through the passive electronic component vertically from a first surface to a second surface of the passive electronic component, the first conductive via electrically connected to the first electrode;
• and
• directly bonding the passive electronic component to an integrated device die without an intervening adhesive,
• wherein the providing the passive electronic component comprises growing the plurality of elongate conductors on the first conductive layer, and
• wherein the passive electronic component comprises a first conductive contact at the first surface that is electrically connected to the second electrode and a second conductive contact at the second surface that is electrically connected to the first electrode.