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US 11,901,276 B2Granted
Semiconductor package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYeonho Jang, Jongyoun Kim, Jungho Park, Jaegwon Jang
Life of this patent
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Abstract
A semiconductor package includes a semiconductor chip; a redistribution insulating layer including a first opening; an external connection bump including a first part in the first opening; a lower bump pad including a first surface in physical contact with the first part of the external connection bump and a second surface opposite to the first surface, wherein the first surface and the redistribution insulating layer partially overlap; and a redistribution pattern that electrically connects the lower bump pad to the semiconductor chip.
Claims20
A method of manufacturing a semiconductor package, the method comprising:
- forming a first insulating layer;
- forming a lower seed layer on the first insulating layer;
- forming a lower bump pad on the lower seed layer, the lower bump pad having a first surface in physical contact with the lower seed layer;
- forming at least one redistribution pattern electrically connected to the lower bump pad and at least one insulating layer on the first insulating layer;
- disposing a semiconductor chip on the at least one redistribution pattern;
- forming a pad opening of the first insulating layer by removing a portion of the first insulating layer, wherein a first part of the lower seed layer is exposed through the pad opening of the first insulating layer;
- and
- removing the first part of the lower seed layer exposed through the pad opening of the first insulating layer to expose a portion of the first surface of the lower bump pad.
5 more elements
A method of manufacturing a semiconductor package, the method comprising:
- forming a redistribution structure;
- and
- disposing a semiconductor chip on the redistribution structure,
- wherein the forming of the redistribution structure comprises:
- forming a first insulating layer;
- forming a lower seed layer on the first insulating layer;
- forming a lower bump pad on the lower seed layer;
- forming at least one redistribution pattern electrically connected to the lower bump pad and at least one insulating layer on the first insulating layer;
- forming a pad opening of the first insulating layer to expose a first part the lower seed layer, by removing a portion of the first insulating layer;
- removing the first part of the lower seed layer exposed through the pad opening of the first insulating layer to expose a bottom surface of the lower bump pad;
- and
- forming an external connection bump connected to the bottom surface of the lower bump pad,
- wherein a second part of the lower seed layer remaining after the removing of the first part of the lower seed layer is in physical contact with an outer portion of the bottom surface of the lower bump pad,
- the external connection bump is in physical contact with a central portion of the bottom surface of the lower bump pad, and
- the central portion of the bottom surface of the lower bump pad and the outer portion of the bottom surface of the lower bump pad are flat.
12 more elements
A method of manufacturing a semiconductor package, the method comprising:
- forming a first insulating layer on a carrier substrate;
- forming a lower seed layer on the first insulating layer;
- forming a lower bump pad on the lower seed layer, the lower bump pad having a flat bottom surface in physical contact with the lower seed layer;
- forming at least one redistribution pattern electrically connected to the lower bump pad and at least one insulating layer on the first insulating layer;
- disposing a semiconductor chip on the at least one redistribution pattern;
- forming a molding layer surrounding a side surface of the semiconductor chip;
- removing the carrier substrate;
- forming a pad opening of the first insulating layer to expose a first part of the lower seed layer, by removing a portion of the first insulating layer;
- removing the first part of the lower seed layer exposed through the pad opening of the first insulating layer to expose a bottom surface of the lower bump pad;
- and
- forming an external connection bump connected to the bottom surface of the lower bump pad,
- wherein a second part of the lower seed layer remaining after the removing of the first part of the lower seed layer is in physical contact with an outer portion of the bottom surface of the lower bump pad,
- the external connection bump is in physical contact with a central portion of the bottom surface of the lower bump pad, and
- the central portion of the bottom surface of the lower bump pad and the outer portion of the bottom surface of the lower bump pad are flat.
11 more elements
Dependencies are inferred from the claim text.