Semiconductor device package
AssigneeAdvanced Semiconductor Engineering Korea, Inc.
InventorsSoonheung Bae, Hyunjoung Kim
Life of this patent
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Abstract
A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
Claims20
A semiconductor device package, comprising:
- a substrate having a first surface;
- a first insulation layer disposed on the first surface of the substrate and having a first surface facing away from the substrate;
- and
- a first electrical contact disposed on the first surface of the substrate;
- wherein the first electrical contact has a portion under an elevation of the first surface of the first insulation layer;
- wherein the first insulation layer has an inclined surface toward the first electrical contact, forming a cavity, and wherein the inclined surface and the portion of the first electrical contact are non-overlapping in a first direction substantially perpendicular to the first surface of the substrate.
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a first electrical contact disposed under the first surface of the substrate;
- a first electronic component under the first surface of the substrate;
- a second electronic component over the second surface of the substrate;
- and
- a first insulation layer disposed on the first surface of the substrate and having a first inclined surface toward the first electrical contact, forming a first cavity;
- wherein the second electronic component overlaps with the first cavity and the first electronic component in a direction substantially perpendicular to the first surface of the substrate.
A method of manufacturing a semiconductor device package, comprising:
- providing a substrate, an electrical contact disposed on the substrate and an encapsulant disposed on the substrate and encapsulating the electrical contact;
- removing a portion of the encapsulant and a portion of the electrical contact so that the electrical contact is exposed from the encapsulant;
- and
- forming a cavity on a first surface of the encapsulant so that the electrical contact is accommodated by the cavity, wherein the electrical contact comprises a side surface facing and spaced apart from an inner side wall of the cavity.
Dependencies are inferred from the claim text.