Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith

A package to which a lid is to be attached to form a sealed space for sealing a power semiconductor element without a gross leak, the package comprising:

• an external terminal electrode;
• a frame to which the external terminal electrode is attached, the frame containing a first resin and having a first adhered surface;
• a heat sink plate supporting the frame, having an unmounted region within the frame in plan view, made of metal, and having a second adhered surface, the unmounted region being a region where the power semiconductor element is to be mounted;
• and
• an adhesive layer containing a second resin different from the first resin and adhering the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other, one of the first and second adhered surfaces including a flat portion and a protruding portion, the protruding portion protruding from the flat portion and opposing the other one of the first and second adhered surfaces with the adhesive layer therebetween, wherein
• the unmounted region is a region where the power semiconductor element is to be mounted while the power semiconductor element has not yet been mounted, and
• wherein hermeticity between the heat sink plate and the frame is heat resistant to heat treatment at 260° C. for two hours.