Choked flow cooling

An electronic package, comprising:

• a lid, wherein the lid has a first opening and a second opening that is opposite from the first opening and wherein air flows from the first opening to the second opening;
• and
• a plate partially closing the first opening and comprising:
• a first surface;
• a second surface opposite from the first surface;
• and
• a plurality of vents extending from the first surface to the second surface, the vents each having a first opening at the first surface with a first dimension and a second opening at the second surface with a second dimension that is smaller than the first dimension, and wherein all of the air that flows from the first opening to the second opening flows through the plurality of vents in the plate partially closing the first opening.

An electronic package, comprising:

• a package substrate;
• a die coupled to the package substrate that is cooled by air;
• a thermal solution on the die;
• a lid over the die, wherein the lid has a first opening and a second opening opposite the first opening and wherein the air flows from the first opening to the second opening;
• and
• a plate partially closing the first opening, wherein the plate comprises a plurality of vents with a non-uniform cross-section, and wherein all of the air coolant that flows from the first opening to the second opening flows through the plurality of vents in the plate partially closing the first opening.