Semiconductor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
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Abstract
A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
Claims20
A method for manufacturing a semiconductor device, comprising:
- providing a device die with a rear surface shaped to form micro-trenches;
- providing a cooling cover with fluid paths enclosed in a casing and a seal trench at a floor panel of the casing;
- and
- attaching the cooling cover onto the rear surface of the device die by using a seal ring filled in the seal trench and in contact with the rear surface of the device die, wherein the seal ring laterally encloses the micro-trenches and seals a space between the cooling cover and the micro-trenches after the cooling cover is attached to the device die.
A method for manufacturing a semiconductor device, comprising:
- providing a device die having a rear surface formed with micro-trenches;
- providing a cooling cover with fluid paths enclosed in a casing and a seal trench at a floor panel of the casing, wherein the fluid paths comprise a fluid inlet port and a fluid outlet port laterally extending into the cooling cover from opposite sidewalls of the casing;
- and
- attaching the cooling cover onto the rear surface of the device die by using a seal ring filled in the seal trench and in contact with the rear surface of the device die, wherein the seal ring laterally encloses the micro-trenches and seals a space between the cooling cover and the micro-trenches after the cooling cover is attached to the device die, and the fluid paths in the cooling cover are communicated with the space sealed by the seal ring.
A method for manufacturing the semiconductor device, comprising:
- providing a device die having a rear surface formed with micro-trenches;
- providing a cooling cover with fluid paths enclosed in a casing and a seal trench at a floor panel of the casing, wherein the fluid paths comprise a fluid inlet port and a fluid outlet port respectively extending to an opening of the casing;
- and
- attaching the cooling cover onto the rear surface of the device die by using a seal ring filled in the seal trench and in contact with the rear surface of the device die, wherein the seal ring laterally encloses the micro-trenches and seals a space between the cooling cover and the micro-trenches after the cooling cover is attached to the device die, and the fluid paths in the cooling cover are in fluid communication with the space sealed by the seal ring.
Dependencies are inferred from the claim text.