# US 11,901,262 B2 · Cooling solution including microchannel arrays and methods of forming the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,901,262 B2 - Document ID: US11901262B2 - Status: Granted - Kind: B2 - Application number: 16/256,831 - Filed: 2019-01-24 - Published: 2020-07-30 - Granted: 2024-02-13 - Earliest claimed: 2019-01-24 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Nicholas Neal; Zhimin Wan; Shankar Devasenathipathy; Je-Young Chang - Web page: https://patentgrep.com/patent/US11901262B2 ## CPC - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/776: {Arrangements for jet impingement, e.g. for spraying} - F28F 19/01: by using means for separating solid materials from heat-exchange fluids, e.g. filters - H10W 40/037: {Assembling together parts thereof} - F28F 3/048: {in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels} - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - F28F 2260/02: having microchannels - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins. ## Claims ### Claim 1 A microelectronic cooling solution comprising: a substrate; a first array of fins, wherein the first array of fins extends vertically from the substrate, and wherein adjacent individual fins of the first array are separated from each other by a microchannel; and a second array of fins extending vertically from the substrate, wherein a channel region is between the first array of fins and the second array of fins, wherein a length of individual fins of the second array of fins is greater than twice a length of individual fins of the first array of fins. ### Claim 2 (depends on 1) The microelectronic cooling solution of claim 1, further comprising a third array of fins extending from the substrate adjacent the second array of fins, wherein the channel region comprises a first channel region, and wherein the second array of fins and the third array of fins are separated from each other by a second channel region. ### Claim 3 (depends on 1) The microelectronic cooling solution of claim 1, wherein a width of the microchannel is below about 100 microns, and wherein a length of individual fins of the second array of fins is greater than about twice a length of individual fins of the first array of fins. ### Claim 4 (depends on 3) The microelectronic cooling solution of claim 3, wherein the cooling solution further comprises a cover, wherein the cover is on a top portion of the cooling solution, wherein an inlet port is on the cover, and is adjacent to the first array of fins, and wherein an outlet port is adjacent to the second array of fins. ### Claim 5 (depends on 1) The microelectronic cooling solution of claim 1, wherein a width of the channel region is substantially equal to a width of the microchannel. ### Claim 6 (depends on 1) The microelectronic cooling solution of claim 1, wherein the microchannel comprises a first microchannel, and wherein individual fins of the second array are separated from each other by a second microchannel, and wherein a width of the second microchannel is substantially equal to a width of the channel region. ### Claim 7 (depends on 1) The microelectronic cooling solution of claim 1, wherein the cooling solution includes a portion of an integrated heat spreader. ### Claim 8 (depends on 1) The microelectronic cooling solution of claim 1, wherein a package structure is thermally coupled to a surface of the cooling solution. ### Claim 9 (depends on 8) The microelectronic cooling solution of claim 8, wherein a device is on a substrate of the package structure, wherein the device is thermally coupled to the cooling solution. ### Claim 10 An assembly comprising: a substrate: a die comprising an integrated circuit, wherein the die is on the substrate; and a cooling solution thermally coupled to the die, the cooling solution comprising: a base; a first array of fins, wherein the first array of fins extends vertically from the base, and wherein individual fins of the first array of fins are separated from each other by a microchannel; and a second array of fins extending vertically from the base, wherein a channel region is between the first array of fins and the second array of fins, and wherein a length of individual fins of the second array of fins is greater than twice a length of individual fins of the first array of fins. ### Claim 11 (depends on 10) The assembly of claim 10, wherein the channel region comprises a rectangular area between the first array of fins and the second array of fins, wherein the channel region is free of fins. ### Claim 12 (depends on 10) The assembly of claim 10, further comprising a third array of fins extending vertically from the base and adjacent the second array of fins, wherein individual fins of the third array of fins are separated from each other by a width of the microchannel, and wherein the channel region comprises a first channel region, and wherein a second channel region is between the second array of fins and the third array of fins. ### Claim 13 (depends on 10) The assembly of claim 10, wherein a thermal interface material (TIM) is directly on a surface of the die, and wherein the TIM is between the cooling solution and the die. ### Claim 14 (depends on 10) The assembly of claim 10, wherein the cooling solution comprises a portion of an integrated heat spreader, wherein a TIM is on a first side of the integrated heat spreader, and wherein a portion of the integrated heat spreader is on the substrate. ### Claim 15 (depends on 10) The assembly of claim 10, wherein an integrated heat spreader is between the die and the cooling solution, wherein a first TIM is between the integrated heat spreader and the die, and a second TIM is between the integrated heat spreader and the cooling solution. ### Claim 16 (depends on 10) The assembly of claim 10, wherein a length of the second array of fins is more than about twice a length of the first array of fins.