Semiconductor device having electrode pads arranged between groups of external electrodes
AssigneeRohm Co., Ltd.
InventorKunihiro Komiya
Life of this patent
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Abstract
The semiconductor device has the CSP structure and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.
Claims18
A semiconductor device comprising:
- a semiconductor substrate having an integrated circuit formed thereon;
- a first plurality of electrode pads, including a first electrode pad, a second electrode pad, a third electrode pad and a fourth electrode pad, wherein the first electrode pad, the second electrode pad, the third electrode pad and the fourth electrode pad are four different electrode pads;
- a first group of electrodes that are formed in a first line and includes a first electrode and a second electrode;
- and
- a second group of electrodes that are formed in a second line and includes a third electrode and fourth electrode, the second line being further from an outermost periphery of the semiconductor substrate and closer to a center of the semiconductor substrate than the first line when viewed along a direction orthogonal to a top surface of the semiconductor substrate, wherein the first electrode, the second electrode, the third electrode, and the fourth electrode are four different electrodes,
- wherein the first plurality of electrode pads is arranged between the first group of electrodes and the second group of electrodes when viewed along the direction orthogonal to the top surface of the semiconductor substrate,
- wherein the first electrode pad is electrically connected by a first metal connection to the first electrode, the second electrode pad is electrically connected by a second metal connection to the second electrode, the third electrode pad is electrically connected by a third metal connection to the third electrode, and the fourth electrode pad is electrically connected by a fourth metal connection to the fourth electrode;
- wherein the first plurality of electrode pads, the first group of electrodes, and the second group of electrodes are arranged such that a first electrical distance from the center of the first electrode pad to the center of the first electrode is substantially equal to a third electrical distance from the center of the third electrode pad to the center of the third electrode, and a second electrical distance from the center of the second electrode pad to the center of the second electrode is substantially equal to a fourth electrical distance from the center of the fourth electrode pad to the center of the fourth electrode, and
- wherein the first plurality of electrode pads is equal in size.
Dependencies are inferred from the claim text.