Embedded die architecture and method of making
AssigneeIntel Corporation
InventorsRobert L. Sankman, Rahul N. Manepalli, Robert Alan May, Srinivas Venkata Ramanuja Pietambaram, Bharat P. Penmecha
Life of this patent
Estimating the term…
Abstract
Various examples provide a semiconductor patch. The patch includes a glass core having first and second opposed major surfaces extending in an x-y direction. The patch further includes a conductive via extending from the first major surface to the second major surface substantially in a z-direction. The patch further includes a bridge die embedded in a dielectric material in communication with the conductive via. The patch further includes an overmold at least partially encasing the glass core.
Claims20
A semiconductor package, comprising:
- a package substrate;
- a glass core;
- an insulator material at least partially encasing the glass core, wherein, along a direction perpendicular to a first surface of the glass core, a portion of the insulator material is between the glass core and the package substrate, and wherein a first surface of the package substrate is closer to the first surface of the glass core than a second surface of the package substrate;
- a conductive via extending between the first surface of the glass core and a second surface of the glass core substantially in the direction perpendicular to the first surface of the glass core;
- a bridge die in a recess in the package substrate and electrically coupled with the conductive via;
- and
- an electronic component coupled to an end of the conductive via at the second surface of the package substrate.
A method of forming a semiconductor package, the method comprising:
- providing a package substrate;
- providing a glass core;
- providing an insulator material at least partially encasing the glass core, wherein, along a direction perpendicular to a first surface of the glass core, a portion of the insulator material is between the glass core and the package substrate, and wherein a first surface of the package substrate is closer to the first surface of the glass core than a second surface of the package substrate;
- providing a conductive via extending between the first surface of the glass core and a second surface of the glass core substantially in the direction perpendicular to the first surface of the glass core;
- providing a bridge die in a recess in the package substrate and electrically coupled with the conductive via;
- and
- providing an electronic component coupled to an end of the conductive via at the second surface of the package substrate.
A semiconductor package, comprising:
- a package substrate having a first surface and a second surface, opposite the first surface;
- a bridge die in a cavity in the second surface of the package substrate;
- a further die above the package substrate;
- one or more electrically conductive interconnects between the bridge die and the further die;
- a glass core having a through-opening between a first surface of the glass core and a second surface of the glass core, wherein the first surface of the glass core is closer to the package substrate than the second surface of the glass core;
- and
- a conductive via extending between the second surface of the glass core and the second surface of the package substrate, wherein a first portion of the conductive via extends through the through-opening of the glass core and a second portion of the conductive via extends through the package substrate.
Dependencies are inferred from the claim text.