Insulating component, semiconductor package, and semiconductor apparatus

An insulating component, comprising:

• an insulating substrate including a upper surface, a side surface, a bottom surface opposite to the upper surface, and a groove located continuously from the upper surface to the side surface;
• a metal layer located on the insulating substrate to which a conductive connecting terminal is joined;
• wherein the metal layer including:
• a first metal layer located on the upper surface and extended in the first direction;
• and
• a second metal layer located on an inner surface of the groove and continuous with the first metal layer;
• wherein the groove includes a first region intersecting the upper surface, a second region located below and connecting to the first region, and a third region located below the second region and connecting to the second region;
• and
• a width of the second region in a second direction perpendicular to the first direction is smaller than a width of the first region in the second direction and a width of the third region in the second direction as viewed from above.