Semiconductor package structure and method for manufacturing the same

A semiconductor package structure, comprising:

• a first semiconductor device having a first periphery side surface, and including a plurality of first electrical contacts disposed on an active surface of the first semiconductor device;
• a second semiconductor device having a second periphery side surface facing the first periphery side surface, and including a plurality of second electrical contacts disposed on an active surface of the second semiconductor device, wherein in a top view, the second periphery side surface is non-parallel with the first periphery side surface;
• and
• at least one conductive trace electrically connecting at least one of the plurality of first electrical contacts and at least one of the plurality of second electrical contacts, wherein in a top view, the at least one conductive trace includes a first segment and a second segment, the first segment directly connects to the at least one of the plurality of first electrical contacts, and is oblique to the first periphery side surface, wherein the second segment directly connects to the at least one of the plurality of second electrical contacts, and is oblique to the second periphery side surface.

A method for manufacturing a semiconductor package structure, comprising:

• providing a first semiconductor device comprising at least one first electrical contact disposed adjacent to an active surface of the first semiconductor device;
• measuring an actual position of the at least one first electrical contact;
• providing at least one second electrical contact outside the first semiconductor device;
• and
• forming an interconnection structure based on the actual position of the at least one first electrical contact of the first semiconductor device and a position of the at least one second electrical contact satisfying a predetermined electrical performance criterion.