Methods of making a radiation detector
AssigneeShenzhen Xpectvision Technology Co., Ltd.
InventorsPeiyan Cao, Yurun Liu
Life of this patent
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Abstract
Disclosed herein is a method comprising: attaching a plurality of chips to a substrate, wherein each of the chips comprises only one pixel configured to detect radiation. Disclosed herein is a method comprising: attaching a wafer to a substrate, wherein the substrate comprises discrete electrodes, wherein the wafer comprises a radiation absorption layer and a plurality of electrical contacts, wherein each of the electrical contacts is connected to at least one of the discrete electrodes; identifying a defective area of the wafer; replacing a portion of the wafer with a chip configured to absorb radiation, the portion comprising the defective area.
Claims6
A method comprising:
- attaching a wafer to a substrate, wherein the substrate comprises discrete electrodes, wherein the wafer comprises a radiation absorption layer and a plurality of electrical contacts, wherein each of the electrical contacts is connected to at least one of the discrete electrodes;
- identifying a defective area of the wafer;
- replacing a portion of the wafer with at least one chip configured to absorb radiation, wherein the portion comprises the defective area.
Dependencies are inferred from the claim text.