Semiconductor-processing tape
AssigneeFurukawa Electric Co., Ltd.
InventorsHirotoki Yokoi, Yukihiro Matsubara
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Abstract
A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 μm, and wherein the adhesive layer has a thickness of 40 μm or more and the storage elastic modulus at 25° C. of 2000 MPa or less.
Claims4
A semiconductor-processing tape, comprising:
- a base material film, a removable adhesive layer, and an adhesive layer, in this order,
- wherein the base material film has the characteristics that stress values in a machine direction (MD) and a transverse direction (TD) at a time of 5%-elongation are each 5 MPa or more, tensile strength values in MD and TD at the time of 5%-elongation are each from 10 to 30 N/25 mm, and a thickness is from 70 to 150 μm,
- wherein the adhesive layer has the characteristics that a thickness is 60 to 200 μm and a storage elastic modulus at 25° C. is 2000 MPa or less, and
- wherein the base material film has a multi-layer structure comprising two or more layers, and wherein each of the two or more layers of the multi-layer structure consists of an ionomer resin only.
Dependencies are inferred from the claim text.