Method for forming photonic integrated package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, An-Jhih Su, Wei-Yu Chen
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Abstract
A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
Claims20
A method comprising:
- placing an electronic die and a photonic die over a carrier;
- encapsulating the electronic die and the photonic die in an encapsulant;
- planarizing the encapsulant, so that an electrical connector in the electronic die is exposed, and a through-via that extends into a semiconductor substrate of the photonic die is exposed;
- forming a redistribution structure over the encapsulant, the electronic die, and the photonic die, wherein a first redistribution line in the redistribution structure is joined to the electrical connector in the electronic die, and a second redistribution line in the redistribution structure is joined to the through-via in the photonic die;
- and
- attaching an optical coupler to the photonic die, wherein an optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
A method comprising:
- placing an electronic die over a carrier, with a back surface of the electronic die facing toward the carrier;
- placing a photonic die over the carrier, with a front surface of the photonic die facing toward the carrier;
- encapsulating the electronic die and the photonic die in an encapsulant;
- forming redistribution lines to electrically connect an electrical connector in the electronic die to a through-via in the photonic die;
- and
- attaching an external optical device to the photonic die, wherein the external optical device is configured to optically couple to a photonic device in the photonic die.
A method comprising:
- attaching an electronic die over a carrier, wherein the electronic die comprises:
- an electrical connector;
- and
- a first semiconductor substrate between the electrical connector and the carrier;
- attaching a photonic die over the carrier, wherein the photonic die comprises:
- a second semiconductor substrate;
- a through-via extending from a bottom surface of the second semiconductor substrate into the second semiconductor substrate;
- forming a redistribution structure comprising redistribution lines connecting to the electrical connector and the through-via;
- and
- attaching an optical fiber to optically couple to the photonic die.
Dependencies are inferred from the claim text.