Backmetal removal methods

A method of forming a semiconductor package, the method comprising:

• forming a plurality of notches into a first side of a semiconductor substrate;
• thinning a second side of the semiconductor substrate opposite the first side to the plurality of notches;
• applying a backmetal over the second side of the semiconductor substrate;
• removing one or more portions of the backmetal through jet ablation;
• and
• singulating the semiconductor substrate into a plurality of semiconductor packages.

A method of forming a semiconductor package, the method comprising:

• forming a die support structure over a first side of a semiconductor substrate and a plurality of notches in the semiconductor substrate;
• thinning a second side of a semiconductor substrate opposite the first side toward the plurality of notches to expose the die support structure in the plurality of notches;
• applying a backmetal over the second side of the semiconductor substrate;
• removing one or more portions of the backmetal through jet ablation;
• and
• singulating the semiconductor substrate into a plurality of semiconductor packages.