Substrate treatment method and substrate treatment equipment
AssigneeOrgano Corporation
InventorsDaisaku Yano, Yukinari Yamashita, Masami Murayama, Koji Yamanaka
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AssigneeOrgano Corporation
InventorsDaisaku Yano, Yukinari Yamashita, Masami Murayama, Koji Yamanaka
Estimating the term…
Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.
A method for manufacturing a substrate treatment equipment comprising a plurality of treatment chambers in each of which a substrate is to be disposed and to each of which a substrate treatment solution for washing and immersing the substrate is to be supplied, a main pipe having an upstream end connected to an ultrapure water circulation pipe of a subsystem of an ultrapure water production equipment, the subsystem including a non-regenerative ion-exchange equipment, and a plurality of treatment solution supply pipes each having an upstream end connected to the main pipe and a downstream end connected to each of the plurality of treatment chambers, the method comprising:
Dependencies are inferred from the claim text.