US 11,901,171 B2 · Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming process

Abstract

In some embodiments, the present disclosure relates to a method that includes aligning a stealth laser apparatus over a wafer using an infrared camera coupled to the stealth laser apparatus. The stealth laser apparatus is used to form a stealth damage region within the wafer that is continuously connected around the wafer and separates an inner region from an outer region of the wafer. The stealth damage region is also arranged at a first distance from an edge of the wafer and extends from a first depth to a second depth beneath a top surface of the wafer. Further, the method includes forming a groove in the wafer to separate the outer region from the inner region of the wafer. The outer region of the wafer is removed using a blade, and a top portion of the inner region of the wafer is removed using a grinding apparatus.

Claims20

Dependent claims

A method comprising:

aligning a stealth laser apparatus over a wafer using an infrared camera coupled to the stealth laser apparatus, wherein the infrared camera aligns the stealth laser apparatus using an alignment mark below the wafer;
using the stealth laser apparatus to form a stealth damage region within the wafer, the stealth damage region separating an inner region of the wafer from an outer region of the wafer;
forming a groove in the wafer to separate the outer region from the inner region of the wafer, wherein the groove extends from a top surface to a bottom surface of the wafer;
and
applying a force to the wafer to remove the outer region of the wafer.

2 more elements

Dependencies are inferred from the claim text.

Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming process

Life of this patent

Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming process

Life of this patent

Abstract

Claims20