Magnetron sputtering apparatus and magnetron sputtering method

A magnetron sputtering apparatus comprising:

• a vacuum chamber storing a substrate;
• a plurality of sputtering mechanisms, each including a target having one surface facing inside of the vacuum chamber, a magnet array, and a moving mechanism configured to reciprocate the magnet array between a first position and a second position along a linear path on the other surface of the target in order to sputter the target;
• a power supply configured to form plasma by supplying power to a target of each of selected sputtering mechanisms among the plurality of sputtering mechanisms so that the selected sputtering mechanisms perform film formation on the substrate, the other sputtering mechanisms being unselected sputtering mechanisms;
• a gas supplier configured to supply a gas for plasma formation into the vacuum chamber;
• and
• a controller configured to output a control signal, in performing the film formation, such that each of magnet arrays of at least two unselected sputtering mechanisms is stopped at a position distant from a selected sputtering mechanism between the first position and the second position, wherein extension lines from moving paths of the magnet arrays of said at least two unselected sputtering mechanisms intersect an extension line from a moving path of a magnet array of said selected sputtering mechanism in plan view, wherein the position distant from the selected sputtering mechanism is a position farther from the selected sputtering mechanism between the first position and the second position.