Vacuum processing apparatus and method of cleaning vacuum processing apparatus

A vacuum processing apparatus which performs plasma processing, the vacuum processing apparatus comprising:

• an electrode flange connected to a high-frequency power supply;
• a shower plate spaced apart from and facing the electrode flange and serving as a cathode together with the electrode flange;
• an insulating shield provided around the shower plate;
• a processing chamber in which a processing-target substrate is to be disposed in an opposite side of the shower plate opposite with respect to the electrode flange;
• an electrode frame attached to the shower plate side of the electrode flange;
• and
• a slide plate attached to a circumferential edge portion of the shower plate on the electrode frame side, wherein
• the electrode frame and the slide plate are slidable in response to thermal deformation that occurs when a temperature of the shower plate is raised or lowered, and a space surrounded by the shower plate, the electrode flange, and the electrode frame is sealable,
• the shower plate is supported by the electrode frame using a support member penetrating through an elongated hole provided in the circumferential edge portion of the shower plate,
• the elongated hole is formed so that the support member is relatively movable in the elongated hole in response to thermal deformation that occurs when a temperature of the shower plate is raised or lowered,
• a gas hole which communicates with the elongated hole to supply a purge gas is provided in the elongated hole, and
• the gas hole communicates with a space surrounded by the shower plate, the electrode flange, the electrode frame, and the slide plate.