Apparatus and methods for controlling ion energy distribution
AssigneeApplied Materials, Inc.
InventorsLinying Cui, James Rogers
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AssigneeApplied Materials, Inc.
InventorsLinying Cui, James Rogers
Estimating the term…
Embodiments of the present disclosure generally relate to apparatus and methods for controlling an ion energy distribution during plasma processing. In an embodiment, the apparatus includes a substrate support that has a body having a substrate electrode for applying a substrate voltage to a substrate, and an edge ring electrode embedded for applying an edge ring voltage to an edge ring. The apparatus further includes a substrate voltage control circuit coupled to the substrate electrode, and an edge ring voltage control circuit coupled to the edge ring electrode. The substrate electrode, edge ring electrode, or both are coupled to a power module configured to actively control an energy distribution function width of ions reaching the substrate, edge ring, or both. Methods for controlling an energy distribution function width of ions during substrate processing are also described.
A pulsed direct current (DC) power delivery system, comprising:
A pulsed direct current (DC) power delivery system, comprising:
A non-transitory computer-readable medium storing instructions that, when executed on a processor, perform operations for controlling a width of an ion energy distribution function (IEDF), the operations comprising:
Dependencies are inferred from the claim text.