Substrate assembly with encapsulated magnetic feature
AssigneeIntel Corporation
InventorsKyu-Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji Yong Park, Junnan Zhao, Seo Young Kim
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Abstract
Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
Claims20
A method of forming a substrate assembly, comprising:
- forming one or more traces on a dummy copper region that is coupled to a dummy core;
- forming a first portion of a magnetic feature on the dummy copper region, wherein a portion of the one or more traces is encircled between the first portion of the magnetic feature and the dummy copper region;
- forming a first dielectric region on the dummy copper region, wherein the first portion of the magnetic feature is encapsulated between the first dielectric region and the dummy copper region;
- removing the dummy copper region and the dummy core;
- forming a second portion of the magnetic feature on an opposite side of the one or more traces from which the first portion of the magnetic feature is located, wherein the portion of the one or more traces is encircled between the first portion of the magnetic feature and the second portion of the magnetic feature;
- and
- forming a second dielectric region on the second portion of the magnetic feature, wherein the magnetic feature is encapsulated between the first dielectric region and the second dielectric region.
A method of fabricating a substrate assembly, the method comprising:
- forming a base substrate;
- forming a magnetic feature encapsulated within the base substrate, the magnetic feature having a top surface opposite a bottom surface, and side surfaces between the top surface and the bottom surface;
- and
- forming a coil, wherein a portion of the coil extends through one or more of the side surfaces of the magnetic feature.
A method of fabricating a computer device, the method comprising:
- providing a printed circuit board (PCB);
- coupling a substrate assembly to the PCB, wherein the substrate assembly includes:
- a base substrate;
- a magnetic feature encapsulated within the base substrate, the magnetic feature having a top surface opposite a bottom surface, and side surfaces between the top surface and the bottom surface;
- and
- a coil, wherein a portion of the coil extends through one or more of the side surfaces of the magnetic feature;
- and
- a semiconductor chip coupled to the substrate assembly, wherein a portion of the semiconductor chip is electrically coupled to the coil.
Dependencies are inferred from the claim text.