Memory device for column repair
AssigneeSamsung Electronics Co., Ltd.
InventorsJooyong Park, Minsu Kim, Daeseok Byeon, Pansuk Kwak
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AssigneeSamsung Electronics Co., Ltd.
InventorsJooyong Park, Minsu Kim, Daeseok Byeon, Pansuk Kwak
Estimating the term…
A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.
An operating method of a memory device, the operating method comprising:
An operating method of a memory device including first page buffers connected to a first bit line group, second page buffers connected to a second bit line group, third page buffers connected to a third bit line group, and fourth page buffers connected to a fourth bit line group, the operating method comprising:
An operating method of a memory device including first page buffers connected to a first bit line group, second page buffers connected to a second bit line group, third page buffers connected to a third bit line group, and fourth page buffers connected to a fourth bit line group, the operating method comprising:
Dependencies are inferred from the claim text.