Surface profile estimation and bump detection for autonomous machine
AssigneeNVIDIA Corporation
InventorsMinwoo Park, Yue Wu, Michael Grabner, Cheng-Chieh Yang
Life of this patent
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AssigneeNVIDIA Corporation
InventorsMinwoo Park, Yue Wu, Michael Grabner, Cheng-Chieh Yang
Estimating the term…
In various examples, surface profile estimation and bump detection may be performed based on a three-dimensional (3D) point cloud. The 3D point cloud may be filtered in view of a portion of an environment including drivable free-space, and within a threshold height to factor out other objects or obstacles other than a driving surface and protuberances thereon. The 3D point cloud may be analyzed—e.g., using a sliding window of bounding shapes along a longitudinal or other heading direction—to determine one-dimensional (1D) signal profiles corresponding to heights along the driving surface. The profile itself may be used by a vehicle—e.g., an autonomous or semi-autonomous vehicle—to help in navigating the environment, and/or the profile may be used to detect bumps, humps, and/or other protuberances along the driving surface, in addition to a location, orientation, and geometry thereof.
A method comprising:
A system comprising:
A processor comprising:
Dependencies are inferred from the claim text.