Systems-in-packages having multiple shielding components
AssigneeAmazon Technologies, Inc.
InventorsKun Tang, Fubin Song, Chaoran Yang
Life of this patent
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Abstract
Systems and methods are disclosed for systems-in-packages that have multiple shielding components. In one embodiment, a system-in-package may include a substrate, an integrated circuit package disposed on the substrate, a system-on-a-chip disposed on the substrate, and a molding compound disposed over the integrated circuit package and the system-on-a-chip. The system-in-package may include a first electromagnetic interference shielding component disposed about the molding compound, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package. The second electromagnetic interference shielding component may have a patterned structure formed thereon.
Claims20
A wirelessly chargeable device comprising:
- a battery;
- and
- a system-in-package electrically coupled to the battery, the system-in-package comprising:
- a printed circuit board;
- a first integrated circuit chip disposed on the printed circuit board;
- a second integrated circuit chip disposed on the printed circuit board;
- a molding compound disposed over the first and the second integrated circuit chips;
- a first electromagnetic interference shielding layer disposed around an outer surface of the first molding compound;
- an insulating layer disposed over the first electromagnetic interference shielding layer;
- a second electromagnetic interference shielding layer disposed over the insulating layer and that forms an outer surface of the system-in-package, the second electromagnetic interference shielding layer comprising a wireless charging coil pattern formed thereon;
- and
- a first conductive component coupled to the second electromagnetic interference shielding layer and the printed circuit board.
A system-in-package comprising:
- a substrate;
- a first integrated circuit (IC) disposed on the substrate;
- a molding compound disposed over the first IC;
- a first electromagnetic interference shielding component disposed about the molding compound;
- an insulating layer disposed over the first electromagnetic interference shielding component;
- a second electromagnetic interference shielding component disposed over the insulating layer and that at least partially forms an outer surface of the system-in-package, wherein the second electromagnetic interference shielding component comprises a patterned structure thereon;
- and
- a first connector coupled to the second electromagnetic interference shielding component and the substrate.
A device comprising:
- a battery;
- and
- a first system-in-package comprising:
- a first substrate;
- a first integrated circuit (IC);
- a second IC;
- a first molding compound disposed over the first IC and the second IC;
- a first electromagnetic interference shielding component disposed about the first molding compound;
- an insulating layer disposed over the first electromagnetic interference shielding component;
- a second electromagnetic interference shielding component disposed over the insulating layer and that at least partially forms an outer surface of the first system-in-package, wherein the second electromagnetic interference shielding component comprises a first patterned structure thereon;
- and
- a first connector coupled to the second electromagnetic interference shielding component and the first substrate.
Dependencies are inferred from the claim text.