Electronic device for manufacturing semiconductor device and operating method of electronic device

An operating method of an electronic device for manufacturing a semiconductor device, the method comprising:

• receiving a design layout and an after cleaning inspection (ACI) layout corresponding to the design layout;
• measuring at least one of a bias(s), a critical dimension (CD), or a mis-align between the design layout and the after cleaning inspection layout;
• tagging features on the after cleaning inspection layout;
• and
• performing learning on a process proximity correction module based on the tagged features and at least one of the bias(s), the critical dimension, or the mis-align.

An electronic device comprising:

• a memory;
• and
• at least one processor configured to execute a machine learning-based process proximity correction module for manufacturing a semiconductor device, by using the memory,
• wherein the at least one processor is configured to
• generate a first after cleaning inspection (ACI) layout by executing the machine learning-based process proximity correction on a design layout stored in the memory;
• adjusting the design layout based on a difference of the design layout and the first after cleaning inspection layout;
• executing the machine learning-based process proximity correction on the adjusted layout to generate a second after cleaning inspection (ACI) layout;
• and
• storing, in the memory, the adjusted layout as a layout in which process proximity correction is completed when a difference of the design layout and the second after cleaning inspection layout is smaller than or equal to a threshold value.