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US 11,899,379 B2Granted
Dynamic generation of layout adaptive packaging
AssigneeApplied Materials, Inc.
InventorsUwe Hollerbach, Thomas L. Laidig
Life of this patent
Estimating the term…
Abstract
Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.
Claims12
A method for processing an apparatus in a maskless microlithography system, comprising:
- obtaining position data on a component and an aspect of an electrical connection to the component for a designed state;
- measuring a stage including the component with at least one device to develop a second set of coordinate data for the component and the electrical connection;
- comparing the obtained coordinate data of the component to the second set of coordinate data for the component to determine an offset of the component measured with the at least one device to the designed state;
- altering the aspect of the electrical connection to the component based, at least in part, upon the offset prior to forming the electrical connection;
- and
- forming an altered electrical connection on an electrical connection location between the component and a fixed perimeter.
3 more elements
A method for processing a substrate in a maskless microlithography system, comprising:
- obtaining coordinate data in a designed state pertaining to at least one component and an aspect of at least one wiring connection to the at least one component, wherein the component is at least one of on and in the substrate;
- measuring the substrate including the component with a device to develop a second set of coordinate data for the component;
- comparing the obtained coordinate data of the component of a stage to the second set of coordinate data for the component to determine an offset of the component measured with the device to the designed state;
- altering the aspect of the at least one wiring connection to the component based, at least in part, upon one of the offset, images of the component used to develop the second set of coordinate data for the component, and the second set of coordinate data for the component prior to forming the at least one wiring connection;
- and
- forming an altered wiring connection on an electrical connection location between an edge of the component and a fixed perimeter.
3 more elements
Dependencies are inferred from the claim text.