Lithography mask
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Cheng Chen, Huan-Ling Lee, Ta-Cheng Lien, Chia-Jen Chen, Hsin-Chang Lee
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Cheng Chen, Huan-Ling Lee, Ta-Cheng Lien, Chia-Jen Chen, Hsin-Chang Lee
Estimating the term…
A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.
A method of manufacturing a mask for use in a semiconductor lithography process performed using light at a lithography wavelength, the method comprising:
A mask fabrication process comprising:
A mask for use in a semiconductor lithography process, the mask comprising:
Dependencies are inferred from the claim text.