Magnetic field shaping for magnetic field current sensor

A current sensor system, comprising:

• a magnetic field sensor comprising a chip plane, a first set of sensor elements sensitive to a first magnetic field component that is aligned in a first direction that is parallel to the chip plane, and a second set of sensor elements sensitive to a second magnetic field component that is aligned in a second direction that is perpendicular to the chip plane, wherein the first set of sensor elements comprise a first sensor element and a second sensor element, and wherein the second set of sensor elements comprise a third sensor element and a fourth sensor element;
• a first conductor structure that traverses a first part of the current sensor system in a third direction that is perpendicular to the first direction and the second direction, wherein the first conductor structure is configured to carry a current parallel to the third direction;
• a second conductor structure electrically connected to the first conductor structure, wherein the second conductor structure traverses a second part of the current sensor system in the first direction, wherein the second conductor structure is configured to carry the current parallel to the first direction;
• and
• a third conductor structure electrically connected to the second conductor structure, wherein the third conductor structure traverses a third part of the current sensor system in the third direction, wherein the third conductor structure is configured to carry the current antiparallel to the third direction,
• wherein the first conductor structure produces a first magnetic field based on the current flowing therethrough, the second conductor structure produces a second magnetic field based on the current flowing therethrough, the third conductor structure produces a third magnetic field based on the current flowing therethrough, and
• wherein the first magnetic field, the second magnetic field, and the third magnetic field produce a first magnetic field distribution of the first magnetic field component and a second magnetic field distribution of the second magnetic field component.

A current sensor system, comprising:

• a magnetic field sensor comprising a chip plane and a first set of sensor elements arranged in the chip plane and sensitive to a first magnetic field component that is aligned in a first direction that is perpendicular to the chip plane, wherein the first set of sensor elements comprise a first sensor element and a second sensor element;
• a first conductor structure that traverses a first part of the current sensor system in a conductor plane that is parallel to the chip plane, wherein the first conductor structure is configured to carry a current parallel to the chip plane;
• a second conductor structure that traverses a second part of the current sensor system, wherein the second conductor structure is configured to carry the current parallel to the chip plane;
• and
• a third conductor structure electrically coupled to and between the first conductor structure and the second conductor structure, wherein the third conductor structure is configured to receive the current from the first conductor structure and provide the current to the second conductor structure,
• wherein the third conductor structure comprises:
• a first conductor segment that extends in the first direction from an end of the first conductor structure;
• a second conductor segment that extends in the first direction from an end of the second conductor structure;
• and
• a third conductor segment that extends from the first conductor segment to the second conductor segment in a second direction that is perpendicular to the first direction such that the third conductor segment extends past the magnetic field sensor.