US 11,898,990 B2Granted

Bonding interface evaluation method and bonding interface evaluation device

AssigneeShimane University

InventorTsuyoshi Mihara

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Abstract

An ultrasonic transverse wave is transmitted or ultrasonic longitudinal wave and transverse wave are transmitted in a perpendicular direction to a bonding interface between materials by transmission such as a probe. A reflection signal of the transmitted transverse wave reflected by the bonding interface and/or a transmission signal of the transmitted transverse wave transmitted through the bonding interface and the longitudinal wave, a reflection signal of the transmitted longitudinal wave reflected by the bonding interface and/or a transmission signal of the transmitted longitudinal wave transmitted through the bonding interface are received by reception such as the probe. A physical quantity of the reflection signal or the transmission signal of the transverse wave, out of the received signals, and the longitudinal wave, a joined state of the bonding interface is evaluated by analysis evaluation, utilizing a predetermined physical quantity of the reflection signal or the transmission signal of the longitudinal wave.

Claims10

Dependent claims

A bonding interface evaluation method for evaluating a joined state of a bonding interface between materials, comprising:

a transmission step of simultaneously transmitting an ultrasonic longitudinal wave and a transverse wave in a substantially perpendicular direction to the bonding interface;
a reception step of receiving a reflection signal of the ultrasonic longitudinal wave transmitted in the transmission step and reflected by the bonding interface and/or a transmission signal of the ultrasonic longitudinal wave transmitted in the transmission step and transmitted through the bonding interface, and a reflection signal of the transverse wave transmitted in the transmission step and reflected by the bonding interface and/or a transmission signal of the transverse wave transmitted in the transmission step and transmitted through the bonding interface;
and
an evaluation step of evaluating a bonding area, an interface opening or a bonding strength of the bonding interface as the joined state of the bonding interface based on a difference between a predetermined physical quantity of the transmission signal of the ultrasonic longitudinal wave and a predetermined physical quantity of the reflection signal of the transverse wave, a difference between a predetermined physical quantity of the reflection signal of the ultrasonic longitudinal wave and a predetermined physical quantity of the transmission signal of the transverse wave, or a difference between a predetermined physical quantity of the reflection signal of the ultrasonic longitudinal wave and a predetermined physical quantity of the reflection signal of the transverse wave, out of signals received in the reception step,
the predetermined physical quantity being a waveform, an amplitude or a spectrum of the reflection signal or the transmission signal.

2 more elements

A bonding interface evaluation device for evaluating a joined state of a bonding interface between materials, comprising:

a probe configured to:
simultaneously transmit ultrasonic longitudinal wave and transverse wave in a substantially perpendicular direction to the bonding interface;
and
receive a reflection signal of the ultrasonic longitudinal wave transmitted from the probe and reflected by the bonding interface and/or a transmission signal of the ultrasonic longitudinal wave transmitted from the probe and transmitted through the bonding interface and a reflection signal of the transverse wave transmitted from the probe and reflected by the bonding interface and/or a transmission signal of the transverse wave transmitted from the probe and transmitted through the bonding interface;
and
a processor configured to:
evaluate a bonding area, an interface opening or a bonding strength of the bonding interface as the joined state of the bonding interface based on a difference between a predetermined physical quantity of the transmission signal of the ultrasonic longitudinal wave and a predetermined physical quantity of the reflection signal of the transverse wave, a difference between a predetermined physical quantity of the reflection signal of the ultrasonic longitudinal wave and a predetermined physical quantity of the transmission signal of the transverse wave, or a difference between a predetermined physical quantity of the reflection signal of the ultrasonic longitudinal wave and a predetermined physical quantity of the reflection signal of the transverse wave, out of signals received by the probe,
the predetermined physical quantity being a waveform, an amplitude or a spectrum of the reflection signal or the transmission signal.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/270,381Filed 29 Jul 2019
Priority: JP 2018-15560522 Aug 2018
Published: US 2021/0181153 A117 Jun 2021
Granted: 13 Feb 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

G01N 29/04
Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by…
G01N 29/043
Analysing solids: in the interior, e.g. by shear waves
G01N 29/11
Analysing solids: by measuring attenuation of acoustic waves
G01N 29/4409
Processing the detected response signal , e.g. electronic circuits specially adapted therefor: by comparison