Micro-opto-mechanical system sensor, arrangement and manufacturing method

A method for manufacturing one or more MOMS sensors, comprising:

• manufacturing one or more sensor wafers, comprising:
• depositing an SiO2 and an Si(x)N(y) layer onto a first Si wafer;
• patterning SiN arms into the Si(x)N(y) layer;
• protecting the Si(x)N(y) layer with a first protection layer of at least 100 nm;
• stripping the SiO2 and Si(x)N(y) layers from a first side of the first Si wafer;
• patterning Si masses and etching the patterned Si masses from the first Si wafer;
• stripping the SiO2 layer and the first protection layer from a second, opposing side of the first Si wafer for releasing the etched masses and the patterned SiN arms;
• and
• manufacturing one or more fiber wafers, comprising:
• etching one or more cavities into a second Si wafer;
• protecting the etched cavities with a second protection layer of at least 100 nm;
• etching fiber passthroughs through the second Si wafer;
• stripping the second protection layer from the second Si wafer;
• coating parylene on the second Si wafer for bonding with a sensor wafer;
• and
• aligning and bonding the sensor wafers and the fiber wafers;
• and
• bonding cap Si wafers on the sensor wafers for forming encapsulated cavities comprising the etched Si masses.