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US 11,898,808 B2Granted
Support plate thin cladding
AssigneeApple Inc.
InventorsRobert F. Meyer, William A. Counts, Michael D. Quinones, Jason P. Shannon, David A. Pakula
Life of this patent
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Abstract
An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.
Claims10
An electronic device, comprising:
- a housing;
- and
- a support component joined to the housing, the support component comprising:
- a thermal conduction layer, the thermal conduction layer comprising a first layer of a first thermally conductive material disposed on a first surface of a second thermally conductive material and a second layer of the first thermally conductive material disposed on a second surface of the second thermally conductive material opposite the first layer of the first thermally conductive material, the second thermally conductive material disposed between the first layer and the second layer of the first thermally conductive material, wherein the first layer of the first thermally conductive material and the second layer of the first thermally conductive material are physically coupled via a portion of the first thermally conductive material extending through the second thermally conductive material;
- and
- a support structure joined to at least one surface of the thermal conduction layer;
- a ratio of a thickness of the thermal conduction layer to a thickness of the support structure being at least 1.5.
4 more elements
Dependencies are inferred from the claim text.