# US 11,898,071 B2 · Pressure-sensitive adhesive sheet for semiconductor wafer processing

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- Number: US 11,898,071 B2
- Document ID: US11898071B2
- Status: Granted
- Kind: B2
- Application number: 17/845,746
- Filed: 2022-06-21
- Published: 2022-12-22
- Granted: 2024-02-13
- Earliest claimed: 2021-06-21
- Assignees: Nitto Denko Corporation
- Applicants: Nitto Denko Corporation
- Inventors: Mariko Teshiba; Hiroki Kono
- Web page: https://patentgrep.com/patent/US11898071B2

## CPC

- C09J 7/385: {Acrylic polymers}
- C09J 7/29: Laminated material (metallised plastics C09J7/22)
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 72/7448: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer}
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/122: the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
- C09J 2301/312: parameters being the characterizing feature
- C09J 2433/00: Presence of (meth)acrylic polymer
- C09J 2433/006: in the substrate
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a pressure-sensitive adhesive sheet for semiconductor wafer processing that is excellent in adhesiveness with a semiconductor wafer, and that has light peelability and suppresses adhesive residue. The pressure-sensitive adhesive sheet for semiconductor wafer processing includes in this order: a base material; an intermediate layer; and a UV-curable pressure-sensitive adhesive layer. The intermediate layer has a storage modulus of elasticity at room temperature, G′1RT, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G′180, of from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G′2RT, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G′280, of from 10 kPa to 1,000 kPa. G′1RT/G′2RT is 1 or more.

## Claims

### Claim 1

A pressure-sensitive adhesive sheet for semiconductor wafer processing, comprising in this order:
a base material composed of a resin;
an intermediate layer including a polymer obtained by polymerizing a monomer composition containing (meth)acrylic acid C1-C20 alkyl esters and an acrylic monomer having a glass transition temperature of 40° C. or more; and
a UV-curable pressure-sensitive adhesive layer including a polymer having a polymerizable carbon-carbon double bond introduced into a side chain thereof,
wherein the intermediate layer has a storage modulus of elasticity at room temperature, G′1RT, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G′180, of from 10 kPa to 500 kPa,
wherein the UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G′2RT, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G′280, of from 10 kPa to 1,000 kPa,
wherein G′1RT/G′2RT is 1 or more, and
wherein the intermediate layer contains a photopolymerization initiator and is free of any UV-curable component.

### Claim 2 (depends on 1)

The pressure-sensitive adhesive sheet for semiconductor wafer processing according to claim 1, wherein the intermediate layer and the UV-curable pressure-sensitive adhesive layer each contain an acrylic resin.

### Claim 3 (depends on 2)

The pressure-sensitive adhesive sheet for semiconductor wafer processing according to claim 2, wherein the acrylic resin contained in the intermediate layer is a polymer obtained by one of emulsion polymerization or solution polymerization.

### Claim 4 (depends on 1)

The pressure-sensitive adhesive sheet for semiconductor wafer processing according to claim 1, wherein the pressure-sensitive adhesive sheet for semiconductor wafer processing is a backgrinding tape.

### Claim 5 (depends on 1)

The pressure-sensitive adhesive sheet for semiconductor wafer processing according to claim 1, wherein the pressure-sensitive adhesive sheet for semiconductor wafer processing is configured to be bonded to a semiconductor wafer having unevenness.