# US 11,898,063 B2 · Chemical-mechanical polishing solution

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- Number: US 11,898,063 B2
- Document ID: US11898063B2
- Status: Granted
- Kind: B2
- Application number: 16/958,338
- Filed: 2018-12-26
- Published: 2021-06-03
- Granted: 2024-02-13
- Earliest claimed: 2017-12-27
- Assignees: Anji Microelectronics (Shanghai) Co., Ltd.
- Applicants: Anji Microelectronics (Shanghai) Co., Ltd.
- Inventors: Wenting Zhou
- Web page: https://patentgrep.com/patent/US11898063B2

## CPC

- C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)}
- C23F 3/06: with acidic solutions
- C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25

## Abstract

The present invention discloses a chemical mechanical polishing slurry, and the chemical mechanical polishing slurry comprises silica abrasive particles and accelerating agents, wherein the accelerating agents are selected from pyridine compound, piperidine compound, pyrrolidine compound or pyrrole compound and their derivatives, which have one or more carboxyl groups, and pyrimidine compound and its derivatives, which have one or more amino groups. The chemical mechanical polishing slurry can simultaneously increase the removal rate of both silicon nitride and polysilicon.

## Claims

### Claim 1

A chemical mechanical polishing slurry, characterized in that the chemical-mechanical polishing slurry consists of silica abrasive particles, first and second accelerating agents, and water;
wherein the first accelerating agent is a carboxyl-group-containing compound selected from a pyridine compound, a piperidine compound, a pyrrolidine compound, a pyrrole compound, and derivatives thereof, and wherein each of the carboxyl-group-containing compounds includes one or more carboxyl groups;
wherein the second accelerating agent is a pyrimidine compound containing one or more amino groups, and
wherein pH value of the chemical mechanical polishing slurry is 2-6.

### Claim 2 (depends on 1)

The chemical mechanical polishing slurry according to claim 1, wherein the mass percent concentration of the silica particles is 1˜15%.

### Claim 3 (depends on 2)

The chemical mechanical polishing slurry according to claim 2, wherein the mass percent concentration of the silica particles is 1˜10%.

### Claim 4 (depends on 1)

The chemical mechanical polishing slurry according to claim 1, wherein the first accelerating agent is one or more carboxyl-group-containing compounds selected from 2-carboxyl pyridine, 3-carboxyl pyridine, 4-carboxyl pyridine, 2,3-dicarboxyl pyridine, 2,4-dicarboxyl pyridine, 2,6-dicarboxyl pyridine, 3,5-dicarboxyl pyridine, 2-carboxyl piperidine, 3-carboxyl piperidine, 4-carboxyl piperidine, 2,3-dicarboxyl piperidine, 2,4-dicarboxyl piperidine, 2,6-dicarboxyl piperidine, 3,5-dicarboxyl piperidine, 2-carboxyl pyrrolidine, 3-carboxyl pyrrolidine, 2,4-dicarboxyl pyrrolidine, 2,5-dicarboxyl pyrrolidine, 2-carboxyl pyrrole, 3-carboxyl pyrrole, 2,5-dicarboxyl pyrrole and 3,4-dicarboxyl pyridine.

### Claim 5 (depends on 4)

The chemical mechanical polishing slurry according to claim 4, wherein the mass percent concentration of the first accelerating agent is 0.01˜1%.

### Claim 6 (depends on 5)

The chemical mechanical polishing slurry according to claim 5, wherein the mass percent concentration of the first accelerating agent is 0.05˜0.6%.

### Claim 7 (depends on 1)

The chemical mechanical polishing slurry according to claim 1, wherein the second accelerating agent is one or more selected from 2-aminopyrimidine, 4-aminopyrimidine, 2,4-diaminopyrimidine, 2,4,5-triaminopyrimidine and derivatives thereof.

### Claim 8 (depends on 7)

The chemical mechanical polishing slurry according to claim 7, wherein the mass percent concentration of the second accelerating agent is 0.01˜1%.

### Claim 9 (depends on 8)

The chemical mechanical polishing slurry according to claim 8, wherein the mass percent concentration of the second accelerating agent is 0.02%˜0.6%.