# US 11,898,028 B2 · Acrylic resin emulsion with high heat resistance, polymeric composition thereof and method for preparing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,898,028 B2 - Document ID: US11898028B2 - Status: Granted - Kind: B2 - Application number: 17/308,053 - Filed: 2021-05-05 - Published: 2022-01-20 - Granted: 2024-02-13 - Earliest claimed: 2020-07-14 - Assignees: Nan Ya Plastics Corporation - Applicants: Nan Ya Plastics Corporation - Inventors: Te-Chao Liao; Sen-Huang Hsu; Hui-Chun Chuang - Web page: https://patentgrep.com/patent/US11898028B2 ## CPC - C08L 33/08: Homopolymers or copolymers of acrylic acid esters - C08F 2/24: with the aid of emulsifying agents - C08F 220/06: Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof - C08F 220/14: Methyl esters {, e.g. methyl (meth)acrylate} - C08F 220/1804: {C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate} - C08F 220/1811: {C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate} - C08K 3/26: Carbonates; Bicarbonates - C08K 5/19: Quaternary ammonium compounds - C08K 5/42: Sulfonic acids; Derivatives thereof - C08K 5/5415: containing at least one Si—O bond - C08K 2003/262: {Alkali metal carbonates} - C08L 2201/08: Stabilised against heat, light or radiation or oxydation - C08L 2201/52: Aqueous emulsion or latex, e.g. containing polymers of a glass transition temperature (Tg) below 20°C - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract An aqueous acrylic resin with high heat resistance, a polymeric composition, and a method for preparing the aqueous acrylic resin with high heat resistance are provided. The polymeric composition includes a monomer composition and a reactive emulsifier. Based on 100 wt % of the monomer composition, the monomer composition includes at least one alkyl group containing methyl acrylate, at least one carboxyl group containing methacrylic acid, an alkene-based unsaturated group containing methyl acrylate, a hydroxyl group containing acrylic polyester polyol and/or a hydroxyl group containing acrylic polyether polyol, and an alkoxysilane. ## Claims ### Claim 1 A polymeric composition for forming an aqueous acrylic resin with high heat resistance, comprising a monomer composition and a reactive emulsifier, wherein based on 100 wt % of the monomer composition, the monomer composition includes: 92 to 98 wt % of at least one first monomer, the first monomer being selected from the group consisting of methyl methacrylate, ethyl acrylate, propyl methacrylate, butyl acrylate, isobutyl methacrylate, pentyl methacrylate, hexyl methacrylate, heptyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, iso-octyl methacrylate, nonyl methacrylate, decyl methacrylate, lauryl methacrylate, octadecyl methacrylate, methoxyethyl methacrylate, n-butyl methacrylate, 2-ethylhexyl acrylate, and ethoxymethyl acrylate; 1 to 4 wt % of at least one second monomer, the second monomer being selected from the group consisting of acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, butenoic acid, and maleic anhydride; 1 to 5 wt % of a third monomer, the third monomer being selected from the group consisting of vinyl acetate, styrene, methyl styrene, vinyl toluene, methacrylonitrile, diacetone acrylamide, N-hydroxymethyl acrylamide, cyclohexyl methacrylate, and isobornyl methacrylate; 1 to 5 wt % of at least one of a hydroxyl group containing acrylic polyester polyol and a hydroxyl group containing acrylic polyether polyol; and 1 to 5 wt % of an alkoxysilane. ### Claim 2 (depends on 1) The polymeric composition according to claim 1, wherein the at least one alkyl group containing methyl acrylate includes methyl methacrylate, n-butyl methacrylate, and butyl acrylate that are added in a weight ratio of 3:1:1. ### Claim 3 (depends on 1) The polymeric composition according to claim 1, wherein the at least one carboxyl group containing methacrylic acid includes acrylic acid and methacrylic acid that are added in a weight ratio of 1:1. ### Claim 4 (depends on 1) The polymeric composition according to claim 1, wherein the alkene-based unsaturated group containing methyl acrylate is isobornyl methacrylate. ### Claim 5 (depends on 1) An aqueous acrylic resin with high heat resistance formed by the polymeric composition as claimed in claim 1. ### Claim 6 (depends on 1) A method for preparing an aqueous acrylic resin with high heat resistance, comprising: forming an aqueous system in a reaction tank, the aqueous system including deionized water, a buffer, an emulsifier and an initiator; forming the polymeric composition as claimed in claim 1 into a pre-emulsion, and adding a portion of the pre-emulsion to the aqueous system to carry out a reaction, so as to form a seeded emulsion; and adding a remaining portion of the pre-emulsion to the aqueous system to continue the reaction. ### Claim 7 (depends on 6) The method according to claim 6, wherein the buffer is sodium bicarbonate or ammonia water, the emulsifier is sodium dodecylbenzene sulfonate, and the initiator is sodium persulfate.