# US 11,897,998 B2 · Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,897,998 B2 - Document ID: US11897998B2 - Status: Granted - Kind: B2 - Application number: 16/759,677 - Filed: 2018-10-26 - Published: 2020-09-17 - Granted: 2024-02-13 - Earliest claimed: 2017-10-27 - Assignees: Eneos Corporation - Applicants: ENEOS Corporation - Inventors: Yoshinori Nishitani; Masaki Minami; Tatsuki Sato - Web page: https://patentgrep.com/patent/US11897998B2 ## CPC - C08G 59/621: {Phenols} - C08G 73/0233: {Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups} - C08G 8/24: with mixtures of two or more phenols which are not covered by only one of the groups C08G8/10 - C08G8/20 - C08K 3/04: Carbon - C08K 3/36: Silica - C08L 61/06: of aldehydes with phenols - C08L 79/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors - H10W 74/10: characterised by their shape or disposition - H10W 74/40: characterised by their materials - H01B 3/40: epoxy resins - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F). ## Claims ### Claim 1 A curable resin composition containing: (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the multifunctional benzoxazine compound being at least one multifunctional benzoxazine compound selected from (1) a multifunctional benzoxazine compound having a structural unit of formula (1) wherein R represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or a linear alkyl group having 1 to 12 carbon atoms, as a substituent, and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, wherein at least one Z represents a linking group, and benzoxazine rings are linked by the linking group; and (2) a multifunctional benzoxazine compound represented by a structure of formula (2) wherein L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 2 to 10 carbon atoms, and the organic group and the alkylene group optionally comprise oxygen and/or sulfur, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, wherein the epoxy compound is at least one compound selected from (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, wherein the curable resin composition has a compounding ratio between component (A) and a total of component (B) and component (C) of 5 parts by mass or more and 150 parts by mass or less, where the compounding ratio is determined by the total of component (B) and component (C) based on 100 parts by mass of component (A), and wherein the curable resin composition has an epoxy equivalent ratio of 0.5 or more and 1.5 or less, where the epoxy equivalent ratio is determined by [total number of epoxy groups in components (B) and (C)]/[number of cyanato groups in component (A)+number of hydroxyl groups in component (D)]. ### Claim 2 (depends on 1) The curable resin composition according to claim 1, wherein (C) the trisphenolmethane type epoxy compound is an epoxy compound represented by a structure of formula (3): wherein, in the formula (3), substituents R each independently represents an alkyl group having 1 to 6 carbon atoms, an allyl group or a phenyl group; m represents the number of the substituent(s) R and is an integer of 0 to 3; and n represents an average value, satisfying 0