# US 11,897,981 B2 · Optical resin and lighting device having same

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- Number: US 11,897,981 B2
- Document ID: US11897981B2
- Status: Granted
- Kind: B2
- Application number: 17/626,243
- Filed: 2020-07-22
- Published: 2022-08-18
- Granted: 2024-02-13
- Earliest claimed: 2019-07-25
- Assignees: LG Innotek Co., Ltd.
- Applicants: LG Innotek Co., Ltd.
- Inventors: Hyun Hee Chae
- Web page: https://patentgrep.com/patent/US11897981B2

## CPC

- C08F 220/1811: {C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate}
- C08F 2/44: Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
- C08F 2/50: with sensitising agents
- C08F 220/18: with acrylic or methacrylic acids
- C08F 220/32: containing epoxy radicals
- C08F 220/325: {containing glycidyl radical, e.g. glycidyl (meth)acrylate}
- C08K 5/005: {Stabilisers against oxidation, heat, light, ozone}
- C08K 5/07: Aldehydes; Ketones
- C08K 5/17: Amines; Quaternary ammonium compounds
- C08K 5/3435: Piperidines
- C09J 133/068: {containing glycidyl groups}
- F21K 9/68: Details of reflectors forming part of the light source
- F21S 43/28131: {Structures comprising multiple layers}
- F21S 43/28135: {Structures encapsulating the light source}
- G02B 1/04: made of organic materials, e.g. plastics (G02B1/08 takes precedence)
- G02B 5/0268: {characterized by the fabrication or manufacturing method}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- B60Q 1/0041: {of several lamps in relation to each other}
- F21S 43/33: characterised by their material, surface treatment or coatings
- F21Y 2115/10: Light-emitting diodes [LED]
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- B60Q: ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

A lighting device disclosed in an embodiment of the invention includes a substrate; a light emitting device disposed on the substrate; a resin layer sealing the light emitting device on the substrate; and a diffusion layer or a reflective substrate disposed on the resin layer, wherein the resin layer includes an oligomer, a monomer, and an additive, wherein the monomer includes IBOA (Iso-bornyl Acrylate), two or more dilution monomers and glycidyl methacrylate (GMA), the additive includes a photoinitiator and an amine-based light stabilizer, and in the oligomer and the monomer, the content of glycidyl methacrylate is 10 to 15%, and the resin layer may be a curable transparent resin cured by ultraviolet light.

## Claims

### Claim 1

An optical resin comprising:
in the optical resin disposed on a surface of a molding member sealing a light emitting chip or a surface of a light emitting device having a light emitting chip,
oligomers, monomers and additives;
wherein the monomer include acrylate having an epoxy group without using acrylate having a hydroxyl group,
the monomer includes IBOA (Iso-bornyl Acrylate), two or more dilution monomers, and glycidyl methacrylate (GMA),
wherein the additive includes a photoinitiator of ultraviolet wavelength and an amine-based light stabilizer,
wherein in the oligomer and the monomer, a content of the oligomer is 20-25%, a content of the IBOA is 40-50%, a content of the two or more dilution monomers is 10-20%, and a content of the glycidyl methacrylate is 10 to 15%,
wherein the optical resin is a curable transparent resin, and
wherein a content of the monomer in the optical resin is three times higher than the content of the oligomer.

### Claim 2 (depends on 1)

The optical resin of claim 1, wherein the two or more dilution monomers include caprolactone acrylate, and lactone methacrylate,
wherein the light stabilizer includes a HALS (Hindered-Amine Light Stabilizers)-based UV stabilizer.

### Claim 3 (depends on 2)

The optical resin of claim 2, wherein the photoinitiator has a higher content than the light stabilizer, and comprises 0.5 to 3 wt % based on a weight of the oligomer and the monomer.

### Claim 4 (depends on 1)

The optical resin of claim 1, wherein the optical resin is directly contacted with the surface of the light emitting device having the light emitting chip and an upper surface of a substrate on which the light emitting device is mounted.

### Claim 5

A lighting device comprising:
a substrate;
a light emitting device disposed on the substrate;
a resin layer sealing the light emitting device on the substrate; and
a diffusion layer or a reflective substrate disposed on the resin layer,
wherein the resin layer includes an oligomer, a monomer and an additive,
wherein the monomer include acrylate having an epoxy group without using acrylate having a hydroxyl group, and the monomer includes IBOA (Iso-bornyl Acrylate), two or more dilution monomers, and glycidyl methacrylate (GMA),
wherein the additive includes a photoinitiator and an amine-based light stabilizer,
wherein in the oligomer and the monomer, content of the oligomer is 20-25%, content of the IBOA is 40-50%, content of the two or more dilution monomers is 10-20%, and content of the glycidyl methacrylate is 10 to 15%,
wherein the resin layer is a curable transparent resin cured by ultraviolet light,
wherein a content of the monomer in a total content of the optical resin is three times higher than the content of the oligomer.

### Claim 6 (depends on 5)

The lighting device of claim 5, wherein the light emitting device includes a light emitting chip therein, and a molding member sealing the light emitting chip, and emitting light in a lateral direction of the resin layer through an emission surface of the molding member,
wherein the emission surface of the molding member is in contact with the resin layer.

### Claim 7 (depends on 5)

The lighting device of claim 5, wherein the photoinitiator is an initiator of ultraviolet wavelength,
wherein a content of the photoinitiator in the resin layer is higher than a content of the light stabilizer.

### Claim 8 (depends on 5)

The lighting device of claim 5, wherein a content of the photoinitiator is 0.5 to 3 wt % based on a sum of a masses of the oligomer and the monomer in the resin layer, and a content of the light stabilizer is 0.5 to 2 wt %.

### Claim 9 (depends on 8)

The lighting device of claim 8, wherein the two or more dilution monomers include caprolactone-based acrylate, and lactone-based methacrylate,
wherein the light stabilizer includes a HALS (Hindered-Amine Light Stabilizers)-based UV stabilizer.

### Claim 10 (depends on 9)

The lighting device of claim 9, wherein the oligomer comprises at least two or more of polyester acrylate, epoxy acrylate, polyether acrylate, and silicone acrylate,
wherein the monomer is a material that does not contain an acrylate having the hydroxy group.

### Claim 11 (depends on 6)

The lighting device of claim 6,
wherein the molding member has a phosphor,
wherein the resin layer is spaced apart from the phosphor.

### Claim 12 (depends on 11)

The lighting device of claim 11,
wherein a thickness of the resin layer is thicker than a thickness of the light emitting device and is in a range of 1.8 mm to 2.5 mm.

### Claim 13 (depends on 12)

The lighting device of claim 12, comprising:
a diffusion layer disposed on the resin layer;
a light transmitting layer adhered between the resin layer and the diffusion layer; and
a light blocking portion disposed between the resin layer and the diffusion layer and overlapping the light emitting device in a vertical direction,
wherein an upper surface of the resin layer has macro cilia and is in contact with the light transmitting layer.

### Claim 14 (depends on 13)

The lighting device of claim 13,
wherein the light blocking portion is in non-contact with the upper surface of the resin layer.

### Claim 15 (depends on 5)

The lighting device of claim 5, wherein a portion of the resin layer is directly contacted with an upper surface of the substrate.
