# US 11,897,973 B2 · Resin composition and article made therefrom > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,897,973 B2 - Document ID: US11897973B2 - Status: Granted - Kind: B2 - Application number: 17/848,783 - Filed: 2022-06-24 - Published: 2023-11-23 - Granted: 2024-02-13 - Earliest claimed: 2022-05-20 - Assignees: Elite Electronic Material (Kunshan) Co., Ltd. - Applicants: Elite Electronic Material (KunShan) Co., Ltd. - Inventors: Chenyu Shen; Rongtao Wang; Xing He; Penghui Fu - Web page: https://patentgrep.com/patent/US11897973B2 ## CPC - C08F 136/06: Butadiene - C08K 5/3415: Five-membered rings - C08K 5/3432: Six-membered rings - C08K 5/5399: Phosphorus bound to nitrogen - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption. ## Claims ### Claim 1 A resin composition, comprising the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less; in Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time; wherein the prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B); and wherein an article made from the resin composition has a dissipation factor variation rate under heat of less than or equal to 30% calculated according to a dissipation factor as measured by reference to JIS C2565 at 10 GHz after being subject to standing still at 188° C. for 48 hours. ### Claim 2 (depends on 1) The resin composition of claim 1, wherein the compound of Formula (1) has a pH value of 5 to 10. ### Claim 3 (depends on 1) The resin composition of claim 1, wherein the polyolefin comprises polybutadiene, polyisoprene, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl-polybutadiene-urethane oligomer, maleic anhydride-butadiene copolymer, polymethylstyrene, hydrogenated polybutadiene, hydrogenated styrene-butadiene-divinylbenzene terpolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer or a combination thereof. ### Claim 4 (depends on 1) The resin composition of claim 1, further comprising 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof: wherein X1 is an oxygen radical or a hydroxyl group; R2 to R5 are independently a hydrogen atom or a C1-C5 alkyl group, and R2 to R5 are not a hydrogen atom at the same time; and R1 is a hydrogen atom, a C1-C5 alkyl group, an amino group, a hydroxyl group, a carbonyl group or a carboxyl group; wherein X2 is an oxygen radical or a hydroxyl group; R7 to R10 are independently a hydrogen atom or a C1-C5 alkyl group, and R7 to R10 are not a hydrogen atom at the same time; and R6 and R11 are independently a hydrogen atom, a C1-C5 alkyl group, an amino group, a hydroxyl group, a carbonyl group or a carboxyl group, or R6 and R11 together define a benzene ring structure; wherein X3 each independently is an oxygen radical or a hydroxyl group; and R12 to R23 are independently a hydrogen atom or a C1-C5 alkyl group, and R12 to R23 are not a hydrogen atom at the same time. ### Claim 5 (depends on 1) The resin composition of claim 1, wherein the prepolymer is prepared by subjecting the component (A) and the component (B) to a prepolymerization reaction having a conversion rate of between 10% and 99%. ### Claim 6 (depends on 1) The resin composition of claim 1, further comprising an unsaturated C═C double bond-containing polyphenylene ether resin. ### Claim 7 (depends on 1) The resin composition of claim 1, further comprising 1,2-bis(vinylphenyl)ethane, bis(vinylbenzyl)ether, divinylbenzene, divinylnaphthalene, divinylbiphenyl, t-butyl styrene, triallyl isocyanurate, triallyl cyanurate, 1,2,4-trivinyl cyclohexane, diallyl bisphenol A, styrene, butadiene, decadiene, octadiene, vinylcarbazole, acrylate or a combination thereof. ### Claim 8 (depends on 1) The resin composition of claim 1, further comprising a benzoxazine resin, an epoxy resin, a polyester resin, a phenolic resin, an amine curing agent, a polyamide, a polyimide, a styrene maleic anhydride, a maleimide resin, a cyanate ester, a maleimide triazine resin or a combination thereof. ### Claim 9 (depends on 1) The resin composition of claim 1, further comprising flame retardant, curing accelerator, inorganic filler, surface treating agent, coloring agent, solvent, toughening agent or a combination thereof. ### Claim 10 An article made from a resin composition, the article comprising a prepreg, a resin film, a laminate or a printed circuit board, wherein: the resin composition comprises the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less; in Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time; wherein the prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B), and the article has a dissipation factor variation rate under heat of less than or equal to 30% calculated according to a dissipation factor as measured by reference to JIS C2565 at 10 GHz after being subject to standing still at 188° C. for 48 hours. ### Claim 11 (depends on 10) The article of claim 10, having a glass transition temperature as measured by reference to IPC-TM-650 2.4.24.4 of greater than or equal to 225° C. ### Claim 12 (depends on 10) The article of claim 10, having a Z-axis ratio of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 1.52%. ### Claim 13 (depends on 10) The article of claim 10, having a peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 3.3 lb/in. ### Claim 14 (depends on 10) The article of claim 10, characterized in that no delamination occurs after subjecting the article to a thermal resistance after moisture absorption test by reference to IPC-TM-650 2.6.16.1 and IPC-TM-650 2.4.23.