# US 11,897,761 B2 · Semiconductor device and method of manufacturing semiconductor device

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- Number: US 11,897,761 B2
- Document ID: US11897761B2
- Status: Granted
- Kind: B2
- Application number: 17/832,904
- Filed: 2022-06-06
- Published: 2022-09-22
- Granted: 2024-02-13
- Earliest claimed: 2019-06-21
- Assignees: Amkor Technology Singapore Holding Pte. Ltd.
- Applicants: Amkor Technology Singapore Holding Pte. Ltd.
- Inventors: Ki Yeul Yang; Kyung Han Ryu; Seok Hun Yun; Bora Baloglu; Hyun Cho; Ramakanth Alapati
- Web page: https://patentgrep.com/patent/US11897761B2

## CPC

- B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
- B81C 1/00182: {Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer}
- B81B 7/007: {Interconnections between the MEMS and external electrical signals}
- B81C 1/00158: {Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039)}
- B81C 1/00301: {Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- B81B 2201/02: Sensors
- B81B 2201/0257: Microphones or microspeakers
- B81B 2201/0264: Pressure sensors
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/753: {between laterally-adjacent chips}
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.

## Claims

### Claim 1

A method of forming electronic devices, comprising: providing a semiconductor substrate having a plurality of sensor devices in a side-by-side configuration, each sensor device comprising:
a sensor top side; a sensor bottom side opposite to the sensor top side; and a cavity extending partially inward from the sensor bottom side; providing a barrier structure having a plurality of barriers each attached to respective sensor bottom side of each of the plurality of sensor devices so that each of the plurality of barriers extends over a respective cavity of each of the plurality of sensor devices, wherein each of the plurality of barriers comprises first barrier strand structures defining first barrier through-holes; and singulating the semiconductor substrate to separate the plurality of sensor devices into individual sensor devices having a singulated barrier; wherein the method, further comprising: providing a base substrate including a dielectric structure, a conductive structure, and a passageway extending through a portion of the base substrate, and attaching one of the individual sensor devices having a singulated barrier to the base substrate so that the singulated barrier is over the passageway and interposed between the base substrate and the one of the individual sensor devices.

### Claim 2 (depends on 1)

The method of claim 1, further comprising:
attaching the semiconductor substrate to a carrier before singulating.

### Claim 3 (depends on 2)

The method of claim 2, wherein:
attaching comprises placing each sensor top side adjacent to the carrier so that the semiconductor substrate is interposed between the carrier and the barrier structure.

### Claim 4 (depends on 1)

The method of claim 1, wherein:
providing the semiconductor substrate comprises providing a plurality of Micro-Electro-Mechanical-System (MEMS) sensor devices.

### Claim 5 (depends on 1)

The method of claim 1, wherein:
providing the barrier structure comprises providing the barrier structure comprising a dielectric film.

### Claim 6 (depends on 1)

The method of claim 1, wherein:
providing the barrier structure comprises:
laminating a dielectric film onto the respective sensor bottom side of each of the plurality of sensor devices; and
after the laminating, providing the first barrier strand structures defining the first barrier through-holes.

### Claim 7 (depends on 1)

The method of claim 1, wherein: attaching the one of the individual sensor devices comprises attaching without a stiffener.

### Claim 8 (depends on 1)

The method of claim 1, wherein: attaching the one of the individual sensor devices comprises attaching with an adhesive.

### Claim 9 (depends on 1)

The method of claim 1, wherein:
providing the barrier structure comprises:
attaching a dielectric film to the semiconductor substrate adjacent to each sensor bottom side; and
after attaching the dielectric film, forming the first barrier strand structures defining the first barrier through-holes in the dielectric film.

### Claim 10

A method of forming electronic devices, comprising: providing a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and electronic devices formed as part of the substrate, wherein each electronic device comprises: an electronic device top side at the substrate top side; an electronic device bottom side opposite to the electronic device top side and at the substrate bottom side; and a cavity extending partially inward from the electronic device bottom side towards the electronic device top side; attaching a barrier structure having a plurality of barriers adjacent to the substrate bottom side, wherein: each of the plurality of barriers extends across a respective cavity; and each of the plurality of barriers comprises first barrier through-holes overlying the respective cavity; attaching the substrate to a carrier; and singulating the substrate to separate the electronic devices into individual electronic devices, wherein: attaching the barrier structure comprises: attaching a dielectric film to the substrate bottom side; and after attaching the dielectric film, forming the first barrier through-holes in the dielectric film.

### Claim 11 (depends on 10)

The method of claim 10, wherein:
attaching the barrier structure comprises:
attaching the barrier structure where each of the plurality of barriers comprises a first barrier body and first barrier strand structures defining the first barrier through-holes; and
singulating comprises singulating through the first barrier body of each of the plurality of barriers.

### Claim 12 (depends on 10)

The method of claim 10, wherein:
attaching the barrier structure comprises:
attaching the barrier structure comprises attaching a barrier structure comprising an organic dielectric film.

### Claim 13 (depends on 10)

The method of claim 10, wherein:
attaching the barrier structure comprises laminating a dielectric film over the substrate bottom side.

### Claim 14 (depends on 10)

The method of claim 10, further comprising:
providing a base substrate including a dielectric structure, a conductive structure, and a passageway extending through a portion of the base substrate, and
attaching one of the individual electronic devices to the base substrate adjacent to the passageway.

### Claim 15 (depends on 14)

The method of claim 14, wherein:
attaching the one of the individual electronic devices comprises attaching without a stiffener.