# US 11,897,756 B2 · Micromechanical device with contact pad

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- Number: US 11,897,756 B2
- Document ID: US11897756B2
- Status: Granted
- Kind: B2
- Application number: 17/735,675
- Filed: 2022-05-03
- Published: 2022-11-17
- Granted: 2024-02-13
- Earliest claimed: 2021-05-17
- Assignees: Robert Bosch GmbH
- Applicants: Robert Bosch GmbH
- Inventors: Jochen Reinmuth; Martin Rambach
- Web page: https://patentgrep.com/patent/US11897756B2

## CPC

- B81B 3/001: {Structures having a reduced contact area, e.g. with bumps or with a textured surface}
- B81B 7/007: {Interconnections between the MEMS and external electrical signals}
- B81C 99/004: {during manufacturing}
- B81B 2203/033: Trenches
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- B81B 2207/097: Interconnects arranged on the substrate or the lid, and covered by the package seal
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

A micromechanical device that includes a MEMS substrate and a cap substrate that enclose at least one first cavity, with at least one contact pad that is situated outside the first cavity. A MEMS structure is situated in the first cavity and connected to the contact pad with the aid of a strip conductor, the strip conductor extending at least partially in the MEMS substrate. The contact pad is situated at a surface of the cap substrate.

## Claims

### Claim 1

A micromechanical device, comprising:
a MEMS substrate and a cap substrate that enclose at least one first cavity;
at least one contact pad situated outside the first cavity; and
a MEMS structure situated in the first cavity and connected to the contact pad using a strip conductor, the strip conductor extending at least partially in the MEMS substrate;
wherein the contact pad is situated in a second cavity formed by the MEMS substrate and by the cap substrate,
wherein the contact pad is situated at an inner surface of the cap substrate and adjoining an upper surface of the second cavity.

### Claim 2 (depends on 1)

The micromechanical device as recited in claim 1, wherein the second cavity has a pad access to an outside via the MEMS substrate.

### Claim 3 (depends on 2)

The micromechanical device as recited in claim 2, wherein the strip conductor includes an electrically conductive connection between the MEMS substrate and the cap substrate.

### Claim 4 (depends on 1)

The micromechanical device as recited in claim 1, wherein the cap substrate includes an integrated electronic circuit.

### Claim 5 (depends on 4)

The micromechanical device as recited in claim 4, wherein the integrated electronic circuit is an application specific integrated circuit (ASIC).

### Claim 6 (depends on 1)

The micromechanical device as recited in claim 1, further comprising:
a wafer stack or a portion of a wafer stack, that includes:
the MEMS substrate and the cap substrate, the MEMS substrate and the cap substrate enclosing a plurality of first cavities;
the at least one contact pad that is situated in the second cavity; and
MEMS structures situated in respective ones of the first cavities, one of the MEMS structures in a first cavity selected from the plurality of first cavities, being connected to the contact pad in the second cavity using the strip conductor.

### Claim 7 (depends on 1)

The micromechanical device as recited in claim 1, further comprising:
a wafer stack or a portion of a wafer stack, that includes:
the MEMS substrate and the cap substrate, the MEMS substrate and the cap substrate enclosing a plurality of first cavities,
a plurality of contact pads situated in the second cavity, and
MEMS structures situated in the first cavities and connected to the contact pads in the second cavity using strip conductors.