# US 11,897,261 B2 · Head and printer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,897,261 B2 - Document ID: US11897261B2 - Status: Granted - Kind: B2 - Application number: 18/187,326 - Filed: 2023-03-21 - Published: 2023-07-13 - Granted: 2024-02-13 - Earliest claimed: 2016-02-19 - Assignees: Brother Kogyo Kabushiki Kaisha - Applicants: Brother Kogyo Kabushiki Kaisha - Inventors: Toru Yamashita - Web page: https://patentgrep.com/patent/US11897261B2 ## CPC - B41J 2/04541: {Specific driving circuit} - B41J 2/04581: {controlling heads based on piezoelectric elements} - B41J 2/14201: {Structure of print heads with piezoelectric elements} - B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm} - H10W 20/427: {Power or ground buses} - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/688: {Flexible insulating substrates} - H10W 72/00: Interconnections or connectors in packages - H10W 90/00: Package configurations - B41J 2002/14241: {having a cover around the piezoelectric thin film element} - B41J 2002/14491: {Electrical connection} - H10W 70/63: Vias, e.g. via plugs - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A head includes: a head unit; and a wiring film configured to be connected to the head unit. The wiring film includes: a flexible substrate; a first IC provided on the flexible substrate; a second IC provided on the flexible substrate; a first wire provided on the flexible substrate to connect the first IC and a first contact portion of the head unit; a second wire provided on the flexible substrate to connect the second IC and a second contact portion of the head unit; and a third wire provided on the flexible substrate. The first IC has a long side extended in a predetermined direction and connected to the first wire, the second IC has a long side extended in the predetermined direction and connected to the second wire, and the first IC and the second IC are aligned along the predetermined direction to be apart from each other. ## Claims ### Claim 1 A head comprising: a head unit; and a wiring film configured to be connected to the head unit, wherein the wiring film includes: a flexible substrate; a first IC provided on the flexible substrate; a second IC provided on the flexible substrate; a first wire provided on the flexible substrate and configured to connect the first IC and a first contact portion of the head unit; a second wire provided on the flexible substrate and configured to connect the second IC and a second contact portion of the head unit; and a third wire provided on the flexible substrate, the first IC has a long side extended in a predetermined direction and connected to the first wire, the second IC has a long side extended in the predetermined direction and connected to the second wire, the first IC and the second IC are aligned along the predetermined direction to be apart from each other in the predetermined direction, and the third wire is arranged in an area between the first IC and the second IC in the predetermined direction. ### Claim 2 (depends on 1) The head according to claim 1, wherein the first wire, the second wire, and the third wire are formed of the same material. ### Claim 3 (depends on 1) The head according to claim 1, wherein the wiring film includes a first constant-potential terminal to which a constant potential is to be applied and a first constant-potential wire connecting the first constant-potential terminal and at least one of the first IC and the second IC, and a part, of the first constant-potential wire, in the area of the flexible substrate is the third wire. ### Claim 4 (depends on 3) The head according to claim 3, wherein the first constant-potential terminal is a terminal to which a ground potential is to be supplied. ### Claim 5 (depends on 3) The head according to claim 3, wherein the first constant-potential terminal is a terminal to which a drive potential driving a first piezoelectric element connected to the first contact portion and a second piezoelectric element connected to the second contact portion of the head unit is to be supplied. ### Claim 6 (depends on 3) The head according to claim 3, wherein the first constant-potential wire includes a connection part connected to the first IC and to the second IC, the connection part extends from the first IC to the second IC across the area of the flexible substrate, and the connection part is the third wire. ### Claim 7 (depends on 3) The head according to claim 3, wherein the wiring film further includes: a second constant-potential terminal to which the constant potential is to be applied; and a second constant-potential wire on an opposite side of the area of the flexible substrate with respect to the first IC or the second IC, the second constant-potential wire connecting the second constant-potential terminal and the first IC or the second IC. ### Claim 8 (depends on 7) The head according to claim 7, wherein the first constant-potential wire configuring the third wire has a width greater than a width of the second constant-potential wire. ### Claim 9 (depends on 7) The head according to claim 7, wherein, in the area of the flexible substrate, the first constant-potential wire extends in a direction intersecting with an intermediate line between the first IC and the second IC. ### Claim 10 (depends on 7) The head according to claim 7, wherein, in the area of the flexible substrate, the first constant-potential wire includes wires arranged at intervals in the predetermined direction. ### Claim 11 (depends on 1) The head according to claim 1, wherein the third wire is at a position not overlapping with the first wire and the second wire. ### Claim 12 (depends on 1) The head according to claim 1, wherein a joining portion between the first IC and the flexible substrate and a joining portion between the second IC and the flexible substrate are sealed with a sealing material different from the third wire. ### Claim 13 (depends on 12) The head according to claim 12, wherein the sealing material is in the area of the flexible substrate. ### Claim 14 (depends on 1) The head according to claim 1, wherein a circuit component is in the area of the flexible substrate. ### Claim 15 (depends on 1) The head according to claim 1, wherein the wiring film includes input terminals arranged in the flexible substrate in the predetermined direction, and the input terminals are on a center side of the flexible substrate in the predetermined direction. ### Claim 16 (depends on 1) The head according to claim 1, wherein the third wire is extended along the predetermined direction. ### Claim 17 A printer comprising: a head unit; a wiring film configured to be connected to the head unit; and a conveyance mechanism configured to convey a medium to be printed by the head unit, wherein the wiring film includes: a flexible substrate; a first IC provided on the flexible substrate; a second IC provided on the flexible substrate; a first wire provided on the flexible substrate and configured to connect the first IC and a first contact portion of the head unit; a second wire provided on the flexible substrate and configured to connect the second IC and a second contact portion of the head unit; and a third wire provided on the flexible substrate, the first IC has a long side extended in a predetermined direction and connected to the first wire, the second IC has a long side extended in the predetermined direction and connected to the second wire, the first IC and the second IC are aligned along the predetermined direction to be apart from each other in the predetermined direction, and the third wire is arranged in an area between the first IC and the second IC in the predetermined direction. ### Claim 18 (depends on 17) The printer according to claim 17, wherein the first wire, the second wire, and the third wire are the same material. ### Claim 19 (depends on 17) The printer according to claim 17, wherein the wiring film includes a first constant-potential terminal to which a constant potential is to be applied and a first constant-potential wire connecting the first constant-potential terminal and at least one of the first IC and the second IC, and a part, of the first constant-potential wire, in the area of the flexible substrate is the third wire. ### Claim 20 (depends on 19) The printer according to claim 19, wherein the first constant-potential terminal is a terminal to which a ground potential is to be supplied.