Composite material with adhesion promoter layer based on Si, C and O

A composite material, comprising:

• a substrate and a polymer layer which are directly interconnected by an adhesion promoter layer,
• wherein the substrate comprises a molded body and a surface of the substrate that directly contacts the adhesion promoter layer comprises a material selected from the group consisting of steel, stainless steel, iron, brass, elemental aluminum, elemental silicon, thermoplastic polymer, and thermoset polymer,
• wherein the adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound,
• wherein a surface of the adhesion promoter layer to which the polymer layer is directly connected has a proportion of C which is >50 at. %, as determined by X-ray photoelectron spectroscopy, and
• wherein the polymer layer is obtained by applying a polymer compound to the adhesion promoter layer and crosslinking the polymer compound to form the polymer layer.